XC2VP20-7FFG1152C

The XC2VP20-7FFG1152C is a Virtex®-II Pro series FPGA from AMD, delivered in a 1152-ball FCBGA package (35×35). It provides a programmable logic platform with substantial I/O density and on-chip memory, intended for commercial embedded and system applications.

As a member of the Virtex-II Pro family, this device targets designs that require a combination of programmable logic, significant embedded RAM, and routing resources—suitable for high-density interfacing, embedded processing tasks, and complex control logic.

Key Features

• Logic Capacity  20,880 logic elements for implementing custom logic, state machines, and datapaths.
• Embedded Memory  Approximately 1.62 Mbits of on-chip RAM to support FIFOs, buffers, and local storage for logic functions.
• High I/O Count  564 I/O pins to support dense external connectivity and multi-channel interfacing.
• Package  1152-FCBGA (35×35) surface-mount package for compact board-level integration.
• Power  Core voltage supply range of 1.425 V to 1.575 V for the device core.
• Operating Grade and Temperature  Commercial grade, specified for 0 °C to 85 °C operation.
• Family-Level Capabilities  Virtex-II Pro family features include embedded multi-gigabit transceiver options (RocketIO/RocketIO X), dedicated 18×18 multiplier blocks, on-chip clock management (DCM), and up to two embedded PowerPC RISC processor blocks (family-level features).
• Compliance and Mounting  Surface-mount design and RoHS-compliant manufacturing.

Typical Applications

• Communications & Networking  Dense I/O and programmable logic make the device suitable for protocol bridging, packet processing front-ends, and board-level interface aggregation.
• Embedded System Prototyping  Provides the logic and memory resources needed for prototyping complex embedded functions and validating SoC-level architectures.
• Video and Signal Processing  Large logic capacity and embedded RAM support implementation of data pipelines, buffering, and custom processing blocks.
• High-Density I/O Control  564 I/Os enable designs that require many parallel interfaces, sensor arrays, or multi-channel control systems.

Unique Advantages

• Substantial Logic Resources: 20,880 logic elements allow for complex custom logic implementations without immediate need for external ASICs.
• Significant On-Chip Memory: Approximately 1.62 Mbits of embedded RAM reduces dependency on external memory for buffering and local data storage.
• High I/O Density: 564 I/O pins simplify system-level integration by supporting numerous parallel interfaces directly on-chip.
• Compact, High-Connectivity Package: 1152-ball FCBGA (35×35) delivers high pin count in a compact footprint for space-constrained boards.
• Commercial Temperature Rating: Specified for 0 °C to 85 °C to match a broad range of commercial applications.
• RoHS Compliant: Environmentally compliant manufacturing reduces end-product regulatory risk.

Why Choose XC2VP20-7FFG1152C?

The XC2VP20-7FFG1152C combines a high logic element count, substantial embedded RAM, and a large I/O complement in a compact FCBGA package, making it well suited for commercial embedded designs that require flexible, board-level programmable logic. Its family-level features—such as dedicated multipliers, clock management, and optional embedded processor/transceiver capabilities—provide architectural options for integrating complex functions on a single device.

This device is positioned for engineering teams and procurement groups seeking a commercially rated FPGA with robust I/O and memory resources for applications like interface aggregation, signal processing, and embedded prototyping. The combination of density, package, and power specifications supports scalable designs that can be maintained and updated through programmable logic.

Request a quote or submit an inquiry to receive pricing and availability information for the XC2VP20-7FFG1152C. Our team can provide technical details and help evaluate this device for your design requirements.