XC2VP20-6FGG676I

The XC2VP20-6FGG676I is a Virtex®-II Pro platform FPGA designed for embedded processing and high-density logic integration. It combines programmable logic resources with on-chip memory, configurable I/O, and platform-level features such as embedded processor blocks and multi-gigabit transceiver support.

Engineered for industrial applications, this device delivers a blend of logic capacity, embedded memory, and extensive I/O in a 676-ball BGA package, making it suitable for systems that require integrated processing, high-speed interfaces, and robust operating range.

Key Features

• Logic Resources — 2,320 CLBs, providing approximately 20,880 logic elements to implement complex user logic and custom processing pipelines.
• Embedded Memory — Approximately 1.6 Mbits of on-chip RAM (1,622,016 total RAM bits) to support buffering, lookup tables, and scratch memory close to logic.
• On‑chip Processing Blocks — Platform includes support for processor blocks such as the PowerPC™ 405 core and related processor block functionality described in the platform specification.
• High‑speed Serial Interfaces — Platform-level support for RocketIO™ multi-gigabit transceivers and RocketIO X where applicable, including telecom/datacom support modes and programmable serial output swing and pre-emphasis options.
• Dedicated DSP Resources — Built-in 18-bit × 18-bit multiplier blocks to accelerate arithmetic and signal-processing tasks.
• Package and I/O — 676-ball BGA (676-FBGA, 27 × 27) with 404 user I/Os to support dense peripheral and board-level connectivity.
• Power and Thermal — Core supply range of 1.425 V to 1.575 V and operating temperature range from −40 °C to 100 °C for industrial deployments.
• Mounting and Compliance — Surface-mount device in RoHS-compliant construction for modern assembly processes.
• Platform-Level Support — Architecture features include SRAM-based in-system configuration, SelectRAM™ memory hierarchy, digitally controlled impedance (DCI) I/O options, and clock-management circuitry as described in the platform documentation.

Typical Applications

• Telecom & Datacom Systems — Implement multi-gigabit serial links and telecom/datacom protocols using the platform’s RocketIO transceiver support and programmable serial interface options.
• Embedded Processing Platforms — Integrate on-chip PowerPC processor blocks with programmable logic and local RAM for compact embedded controllers and protocol offload.
• Signal Processing — Leverage 18×18 multipliers and on-chip RAM for FIR filters, FFTs, and other DSP functions requiring close-coupled arithmetic resources.
• High‑I/O, High‑Density Systems — Use the 404 I/O pins and 676-BGA package to consolidate interfaces in communication equipment, test instruments, and industrial control systems.

Unique Advantages

• Integrated Processor and Logic: Combines embedded processor block capability with a sizeable logic fabric to reduce external components and simplify system architecture.
• Significant On‑Chip Memory: Approximately 1.6 Mbits of embedded RAM enables local buffering and data staging without relying on external memory for many functions.
• High I/O Count in Dense Package: 404 I/Os in a 676-FBGA (27 × 27) package provide board-level connectivity while maintaining a compact footprint.
• Industrial Operating Range: Rated from −40 °C to 100 °C, supporting deployment in industrial environments where wider temperature tolerance is required.
• Platform Features for High‑Speed Links: RocketIO transceiver support and programmable serial interface parameters help implement telecom/datacom and other high-speed serial applications.
• Standards‑Aware Manufacturing: Surface-mount, RoHS-compliant construction aligns with contemporary assembly and environmental requirements.

Why Choose XC2VP20-6FGG676I?

The XC2VP20-6FGG676I positions itself as a versatile platform device for designs that require embedded processing capability, substantial on-chip RAM, and a high number of I/Os in a compact BGA package. Its combination of logic density, DSP multipliers, and platform-level transceiver/processor support makes it appropriate for industrial communications, embedded control, and signal-processing applications.

For teams targeting solutions that need integrated processor blocks, multi-gigabit serial interface support, and a robust operating temperature range, this Virtex®-II Pro device provides the building blocks to consolidate functionality, reduce external components, and accelerate time-to-deployment while adhering to RoHS requirements.

Request a quote or contact sales to submit your requirements and receive pricing and availability for the XC2VP20-6FGG676I.