XC2VP20-6FFG896C

The XC2VP20-6FFG896C is a Virtex®-II Pro field programmable gate array (FPGA) from AMD, supplied in an 896-ball flip-chip BGA (896-FCBGA, 31×31) package. It delivers a balanced combination of programmable logic, embedded memory, and high I/O density for demanding embedded and communications-oriented designs.

Built on the Virtex-II Pro platform, this device targets applications that require substantial on-chip logic and memory, extensive I/O connectivity, and platform-level support such as IP cores and reference materials found in the Virtex-II Pro family documentation.

Key Features

• Logic Capacity — 20,880 logic elements to implement complex custom logic and control functions.
• Embedded Memory — Approximately 1.62 Mbits of on-chip RAM for buffering, lookup tables, and local data storage.
• I/O Density — 556 user I/O pins to support high-pin-count interfaces and multi-channel connectivity.
• Package — 896-ball flip-chip BGA (896-FCBGA) in a 31×31 footprint, optimized for surface-mount PCB assembly.
• Power and Thermal — Core supply range from 1.425 V to 1.575 V and specified commercial operating temperature range of 0 °C to 85 °C.
• On-chip Resources (Platform) — As part of the Virtex-II Pro family, platform features include embedded processor block options, multi-gigabit transceiver support, dedicated 18×18 multipliers, digital clock management, and a SelectRAM™ memory hierarchy (refer to family documentation for details).
• Regulatory — RoHS-compliant for environmental and regulatory alignment.

Typical Applications

• Telecom & Datacom Interfaces — Use the high I/O count and family-level transceiver resources for protocol bridging, line cards, and data path processing.
• Embedded Processing Systems — Combine programmable logic with on-chip processing resources and memory to implement control planes and custom accelerators.
• High-density I/O Systems — Leverage 556 I/O pins and a compact 896-FCBGA package for multi-channel interface aggregation and board-level integration.
• Prototyping & System Integration — Suitable for development of custom logic and system prototyping where substantial logic and embedded memory are required.

Unique Advantages

• High Logic Density: 20,880 logic elements enable implementation of substantial custom logic functions without external gate arrays.
• Significant On-chip Memory: Approximately 1.62 Mbits of embedded RAM reduces dependence on external memory for many buffering and LUT needs.
• Extensive I/O: 556 I/O pins support broad interface options and simplify routing for multi-channel designs.
• Compact, Assembly-friendly Package: 896-FCBGA (31×31) provides high ball count in a compact footprint for dense PCB layouts.
• Platform-level Resources: Access to Virtex-II Pro family features such as embedded processor blocks, transceiver capabilities, and dedicated multipliers helps accelerate system-level design.
• Commercial-grade Specification: Rated for 0 °C to 85 °C operation with RoHS compliance for mainstream embedded and communications products.

Why Choose XC2VP20-6FFG896C?

The XC2VP20-6FFG896C positions itself as a versatile Virtex®-II Pro platform device that balances logic capacity, embedded memory, and high I/O count in a compact 896-FCBGA package. It is well suited for engineers and teams building embedded processing, communications, and high-density I/O systems that benefit from on-chip resources and platform-level documentation and IP support.

With defined core voltage requirements and a commercial operating temperature range, this device provides predictable electrical and thermal requirements for production designs while maintaining environmental compliance through RoHS alignment.

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