XC2VP20-6FF896C

IC FPGA 556 I/O 896FCBGA
Part Description

Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 556 1622016 20880 896-BBGA, FCBGA

Quantity 1,695 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package896-FCBGA (31x31)GradeCommercialOperating Temperature0°C – 85°C
Package / Case896-BBGA, FCBGANumber of I/O556Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs2320Number of Logic Elements/Cells20880
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1622016

Overview of XC2VP20-6FF896C – Virtex®-II Pro Field Programmable Gate Array (FPGA)

The XC2VP20-6FF896C is a Virtex®-II Pro platform FPGA supplied in an 896-ball flip-chip BGA package. It provides a high-density, configurable hardware resource set including logic, embedded memory, and system-level I/O suitable for complex digital designs.

Built on the Virtex-II Pro platform, the device supports platform-level features described in the product specification—such as embedded processor block support and high-speed transceiver technology—while offering a commercial-grade operating range and RoHS compliance for mainstream electronic systems.

Key Features

  • Logic Capacity  20,880 logic elements providing substantial room for custom logic, state machines, and glue logic integration.
  • Configurable Logic Blocks (CLBs)  2,320 CLBs for dense logic packing and flexible routing (platform CLB resources per device).
  • Embedded Memory  Approximately 1.6 Mbits of on-chip RAM (1,622,016 bits) for buffering, FIFOs, and state storage.
  • High I/O Count  556 user I/O pins to accommodate multiple parallel interfaces and board-level connectivity requirements.
  • Platform-Level Processing  Family-level support for embedded processor blocks (PowerPC RISC cores) as detailed in the Virtex-II Pro specification.
  • High-Speed Serial Options  Platform support for RocketIO™ Multi-Gigabit Transceivers (MGTs) for serial communications capability as described in the product specification.
  • On-Chip DSP Primitives  Platform documentation references dedicated 18-bit × 18-bit multiplier blocks for fixed-point arithmetic acceleration.
  • Package  896-ball FCBGA package (896-FCBGA, 31 × 31 mm) for high pin density and reliable board mounting.
  • Power and Thermal  Core supply range 1.425 V to 1.575 V; commercial operating temperature 0 °C to 85 °C.
  • Regulatory  RoHS compliant.

Typical Applications

  • Embedded processing and control  Leverage the platform’s embedded processor block support to consolidate system control tasks and offload host processors.
  • High-speed serial communications  Use the platform-level RocketIO transceiver capability for multi-gigabit serial links and board-to-board communications.
  • DSP and signal processing  Take advantage of the device’s logic, embedded memory, and multiplier resources for custom DSP pipelines and acceleration.
  • Complex I/O aggregation  With 556 user I/Os, the device suits applications that require many parallel interfaces, bridging, or protocol handling.

Unique Advantages

  • High integration density: 20,880 logic elements and ~1.6 Mbits of embedded RAM reduce external component count and simplify board design.
  • Extensive I/O resources: 556 user I/Os enable broad peripheral connectivity without multiple interface chips.
  • Platform-level system features: Support for on-chip processor blocks and RocketIO transceivers allows consolidating processing and high-speed serial functions within the FPGA fabric.
  • Robust packaging: 896-FCBGA (31 × 31 mm) delivers high pin density for complex, multi-signal board layouts.
  • Commercial operating range: Designed for 0 °C to 85 °C operation with a defined core voltage range (1.425 V–1.575 V) for predictable system integration.
  • Environmentally compliant: RoHS compliance supports modern manufacturing and regulatory requirements.

Why Choose XC2VP20-6FF896C?

The XC2VP20-6FF896C positions itself as a high-density Virtex®-II Pro platform FPGA that combines substantial logic and embedded memory with a large I/O count and platform-level capabilities described in the Virtex-II Pro specification. Its 896-ball FCBGA package and defined electrical/thermal operating points make it suitable for commercial electronic systems requiring integrated processing, high I/O bandwidth, and flexible logic implementation.

This device is appropriate for design teams needing a robust, configurable silicon substrate for tasks such as on-chip processing, multi-gigabit serial connectivity, DSP acceleration, or complex interface aggregation—providing scalability and reuse across system platforms documented by the Virtex-II Pro product specification.

If you would like pricing, availability, or a formal quote for the XC2VP20-6FF896C, submit a request for a quote or a pricing inquiry and our team will respond with details.

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