XC2VP20-6FF896C
| Part Description |
Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 556 1622016 20880 896-BBGA, FCBGA |
|---|---|
| Quantity | 1,695 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FCBGA (31x31) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BBGA, FCBGA | Number of I/O | 556 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 2320 | Number of Logic Elements/Cells | 20880 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1622016 |
Overview of XC2VP20-6FF896C – Virtex®-II Pro Field Programmable Gate Array (FPGA)
The XC2VP20-6FF896C is a Virtex®-II Pro platform FPGA supplied in an 896-ball flip-chip BGA package. It provides a high-density, configurable hardware resource set including logic, embedded memory, and system-level I/O suitable for complex digital designs.
Built on the Virtex-II Pro platform, the device supports platform-level features described in the product specification—such as embedded processor block support and high-speed transceiver technology—while offering a commercial-grade operating range and RoHS compliance for mainstream electronic systems.
Key Features
- Logic Capacity 20,880 logic elements providing substantial room for custom logic, state machines, and glue logic integration.
- Configurable Logic Blocks (CLBs) 2,320 CLBs for dense logic packing and flexible routing (platform CLB resources per device).
- Embedded Memory Approximately 1.6 Mbits of on-chip RAM (1,622,016 bits) for buffering, FIFOs, and state storage.
- High I/O Count 556 user I/O pins to accommodate multiple parallel interfaces and board-level connectivity requirements.
- Platform-Level Processing Family-level support for embedded processor blocks (PowerPC RISC cores) as detailed in the Virtex-II Pro specification.
- High-Speed Serial Options Platform support for RocketIO™ Multi-Gigabit Transceivers (MGTs) for serial communications capability as described in the product specification.
- On-Chip DSP Primitives Platform documentation references dedicated 18-bit × 18-bit multiplier blocks for fixed-point arithmetic acceleration.
- Package 896-ball FCBGA package (896-FCBGA, 31 × 31 mm) for high pin density and reliable board mounting.
- Power and Thermal Core supply range 1.425 V to 1.575 V; commercial operating temperature 0 °C to 85 °C.
- Regulatory RoHS compliant.
Typical Applications
- Embedded processing and control Leverage the platform’s embedded processor block support to consolidate system control tasks and offload host processors.
- High-speed serial communications Use the platform-level RocketIO transceiver capability for multi-gigabit serial links and board-to-board communications.
- DSP and signal processing Take advantage of the device’s logic, embedded memory, and multiplier resources for custom DSP pipelines and acceleration.
- Complex I/O aggregation With 556 user I/Os, the device suits applications that require many parallel interfaces, bridging, or protocol handling.
Unique Advantages
- High integration density: 20,880 logic elements and ~1.6 Mbits of embedded RAM reduce external component count and simplify board design.
- Extensive I/O resources: 556 user I/Os enable broad peripheral connectivity without multiple interface chips.
- Platform-level system features: Support for on-chip processor blocks and RocketIO transceivers allows consolidating processing and high-speed serial functions within the FPGA fabric.
- Robust packaging: 896-FCBGA (31 × 31 mm) delivers high pin density for complex, multi-signal board layouts.
- Commercial operating range: Designed for 0 °C to 85 °C operation with a defined core voltage range (1.425 V–1.575 V) for predictable system integration.
- Environmentally compliant: RoHS compliance supports modern manufacturing and regulatory requirements.
Why Choose XC2VP20-6FF896C?
The XC2VP20-6FF896C positions itself as a high-density Virtex®-II Pro platform FPGA that combines substantial logic and embedded memory with a large I/O count and platform-level capabilities described in the Virtex-II Pro specification. Its 896-ball FCBGA package and defined electrical/thermal operating points make it suitable for commercial electronic systems requiring integrated processing, high I/O bandwidth, and flexible logic implementation.
This device is appropriate for design teams needing a robust, configurable silicon substrate for tasks such as on-chip processing, multi-gigabit serial connectivity, DSP acceleration, or complex interface aggregation—providing scalability and reuse across system platforms documented by the Virtex-II Pro product specification.
If you would like pricing, availability, or a formal quote for the XC2VP20-6FF896C, submit a request for a quote or a pricing inquiry and our team will respond with details.

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