XC2VP20-6FF1152I

The XC2VP20-6FF1152I is a Virtex®-II Pro field programmable gate array in a 1152‑FBGA (1152‑FCBGA, 35×35) package. It delivers high-density programmable logic with 2320 CLBs (providing 20,880 logic cells), approximately 1.622 Mbits of embedded memory, and 564 user I/Os for designs that require large logic capacity and extensive external connectivity.

Built on the Virtex-II Pro platform, the device supports SRAM-based in-system configuration and is targeted at industrial-grade applications operating from -40 °C to 100 °C, with a supply voltage range of 1.425 V to 1.575 V.

Key Features

• Logic Capacity — 2320 CLBs delivering 20,880 logic cells for implementing complex custom logic and control functions.
• On‑chip Memory — Approximately 1.622 Mbits of embedded RAM to support buffering, FIFOs, and data storage close to logic.
• High I/O Count — 564 user I/Os to interface with high‑pin‑count peripherals, buses, and high‑density connectors.
• Package & Mounting — 1152‑FCBGA (35×35) ball grid array in a surface‑mount package suitable for compact board layouts.
• Power Supply — Operates from 1.425 V to 1.575 V to align with system supply domains.
• Industrial Temperature Grade — Specified for operation from -40 °C to 100 °C for demanding environments.
• RoHS Compliant — Meets RoHS requirements for hazardous-substance reduction in electronics manufacturing.
• Virtex‑II Pro Platform Features — Family architecture includes SRAM-based in-system configuration, dedicated multiplier blocks and SelectRAM memory hierarchy for efficient implementation of DSP and control tasks.

Typical Applications

• High-density embedded processing — Use the XC2VP20-6FF1152I where substantial programmable logic and on-chip RAM are required to implement custom processors, protocol handling, or data-path control.
• Communications and I/O aggregation — High I/O count enables aggregation, bridging, and interface conversions across many external signals and buses.
• Industrial control and automation — Industrial temperature rating and extensive logic resources support complex control algorithms, motor control interfaces, and sensor integration.
• Prototyping and system integration — Dense logic and memory make this device suitable for system prototyping that requires consolidation of multiple functions into a single FPGA.

Unique Advantages

• High logic density: 2320 CLBs and 20,880 logic cells enable consolidation of large digital functions, reducing board-level component count.
• Substantial embedded memory: Approximately 1.622 Mbits of RAM minimizes external memory dependencies for buffering and intermediate storage.
• Extensive external connectivity: 564 I/Os provide flexibility to connect multiple peripherals, sensors, and subsystems without external multiplexing.
• Industrial readiness: Rated for -40 °C to 100 °C and RoHS compliant for deployment in industrial environments and modern manufacturing flows.
• Compact, surface-mount package: 1152‑FCBGA (35×35) lets you fit high-capacity FPGA capability into space-constrained PCBs.
• Platform-level integration: Virtex‑II Pro platform features such as SRAM-based configuration and dedicated multiplier blocks help streamline implementation of compute- and memory-intensive functions.

Why Choose XC2VP20-6FF1152I?

The XC2VP20-6FF1152I combines substantial logic capacity, on-chip memory, and a very high I/O count in a compact 1152‑FCBGA package. Its specifications address designs that need dense programmable logic, significant embedded RAM, and broad external interfacing while meeting industrial temperature requirements.

This device is suited for engineering teams seeking a platform FPGA that supports complex control, data-path, and I/O-centric designs, offering scalability within the Virtex‑II Pro family and predictable electrical and thermal operating bounds for robust system integration.

Request a quote or submit an availability inquiry to receive pricing and lead‑time information for the XC2VP20-6FF1152I.