XC2VP20-5FGG676I

IC FPGA 404 I/O 676FBGA
Part Description

Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 404 1622016 20880 676-BGA

Quantity 601 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case676-BGANumber of I/O404Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2320Number of Logic Elements/Cells20880
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1622016

Overview of XC2VP20-5FGG676I – Virtex-II Pro Field Programmable Gate Array (FPGA), 676-BGA, Industrial Grade

The XC2VP20-5FGG676I is an AMD Virtex®-II Pro platform FPGA offered in a 676-BGA package. It combines a high-density programmable fabric with on-chip embedded resources aimed at designs that require integrated processing, high-speed serial interfaces, and ample on-chip memory.

Typical use cases include telecom/datacom systems, embedded processing applications, and designs that need multi-gigabit serial links and flexible I/O in an industrial-temperature device.

Key Features

  • Logic Capacity  Approximately 20,880 logic elements to implement complex custom logic and control functions.
  • Embedded Memory  Approximately 1.62 Mbits of total on-chip RAM for buffering, packet storage, and state memory.
  • High-Speed Transceiver & Serial Support  Virtex-II Pro family features include support for RocketIO™ / RocketIO X multi-gigabit transceivers and telecom/datacom clocking modes as described in the product family documentation.
  • Embedded Processor Blocks  Family-level support for up to two IBM PowerPC™ RISC processor blocks for offloading control and system tasks.
  • DSP & Memory Primitives  Architecture-level primitives include 18-bit × 18-bit multipliers and 18-Kb block SelectRAM resources as detailed in the family specification.
  • Package & Mounting  676-BGA package (supplier device package: 676-FBGA, 27×27) with surface-mount mounting for high-density board integration.
  • Voltage & Temperature Range  Voltage supply range of 1.425 V to 1.575 V and an operating temperature range of −40 °C to 100 °C suitable for industrial applications.
  • Compliance  RoHS-compliant construction for regulatory alignment in lead-free assemblies.

Typical Applications

  • Telecommunications & Datacom  Implements protocol engines and line interfaces using multi-gigabit transceivers and family telecom/datacom support modes.
  • Embedded Computing  Integrates application-specific logic with on-chip PowerPC processor blocks for compact system-on-chip designs.
  • High-Speed Serial Link Systems  Enables serializer/deserializer and link-layer implementations leveraging RocketIO transceiver capabilities described for the family.
  • Industrial Control & Instrumentation  Industrial-grade operating range and high I/O count support complex control, monitoring, and data-acquisition functions.

Unique Advantages

  • Highly integrated solution: Combines programmable logic, embedded memory, DSP primitives, and processor blocks to reduce external components and simplify system architecture.
  • Multi-gigabit-ready: Family-level RocketIO transceiver support enables direct implementation of high-speed serial links and telecom/datacom protocols.
  • Industrial operating range: Specified for −40 °C to 100 °C operation to meet the requirements of industrial applications.
  • High I/O density: 404 user I/O pins provide flexible interfacing to peripherals, memory, and high-speed links.
  • Detailed technical documentation: Comprehensive family datasheet and module-level documentation provide the electrical, timing, and pinout information needed for system integration.

Why Choose XC2VP20-5FGG676I?

The XC2VP20-5FGG676I offers a combination of programmable logic density, embedded memory, high I/O count, and family-level support for multi-gigabit transceivers and embedded PowerPC processors. Its industrial temperature rating and RoHS compliance make it suitable for demanding embedded and communications systems that require long-term robustness.

This device is well suited for teams building systems that need integrated processing, flexible I/O, and on-chip memory resources while relying on comprehensive datasheet documentation for design and integration.

Request a quote or submit an inquiry to receive pricing and availability information for the XC2VP20-5FGG676I.

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