XC2VP20-5FGG676I
| Part Description |
Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 404 1622016 20880 676-BGA |
|---|---|
| Quantity | 601 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BGA | Number of I/O | 404 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2320 | Number of Logic Elements/Cells | 20880 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1622016 |
Overview of XC2VP20-5FGG676I – Virtex-II Pro Field Programmable Gate Array (FPGA), 676-BGA, Industrial Grade
The XC2VP20-5FGG676I is an AMD Virtex®-II Pro platform FPGA offered in a 676-BGA package. It combines a high-density programmable fabric with on-chip embedded resources aimed at designs that require integrated processing, high-speed serial interfaces, and ample on-chip memory.
Typical use cases include telecom/datacom systems, embedded processing applications, and designs that need multi-gigabit serial links and flexible I/O in an industrial-temperature device.
Key Features
- Logic Capacity Approximately 20,880 logic elements to implement complex custom logic and control functions.
- Embedded Memory Approximately 1.62 Mbits of total on-chip RAM for buffering, packet storage, and state memory.
- High-Speed Transceiver & Serial Support Virtex-II Pro family features include support for RocketIO™ / RocketIO X multi-gigabit transceivers and telecom/datacom clocking modes as described in the product family documentation.
- Embedded Processor Blocks Family-level support for up to two IBM PowerPC™ RISC processor blocks for offloading control and system tasks.
- DSP & Memory Primitives Architecture-level primitives include 18-bit × 18-bit multipliers and 18-Kb block SelectRAM resources as detailed in the family specification.
- Package & Mounting 676-BGA package (supplier device package: 676-FBGA, 27×27) with surface-mount mounting for high-density board integration.
- Voltage & Temperature Range Voltage supply range of 1.425 V to 1.575 V and an operating temperature range of −40 °C to 100 °C suitable for industrial applications.
- Compliance RoHS-compliant construction for regulatory alignment in lead-free assemblies.
Typical Applications
- Telecommunications & Datacom Implements protocol engines and line interfaces using multi-gigabit transceivers and family telecom/datacom support modes.
- Embedded Computing Integrates application-specific logic with on-chip PowerPC processor blocks for compact system-on-chip designs.
- High-Speed Serial Link Systems Enables serializer/deserializer and link-layer implementations leveraging RocketIO transceiver capabilities described for the family.
- Industrial Control & Instrumentation Industrial-grade operating range and high I/O count support complex control, monitoring, and data-acquisition functions.
Unique Advantages
- Highly integrated solution: Combines programmable logic, embedded memory, DSP primitives, and processor blocks to reduce external components and simplify system architecture.
- Multi-gigabit-ready: Family-level RocketIO transceiver support enables direct implementation of high-speed serial links and telecom/datacom protocols.
- Industrial operating range: Specified for −40 °C to 100 °C operation to meet the requirements of industrial applications.
- High I/O density: 404 user I/O pins provide flexible interfacing to peripherals, memory, and high-speed links.
- Detailed technical documentation: Comprehensive family datasheet and module-level documentation provide the electrical, timing, and pinout information needed for system integration.
Why Choose XC2VP20-5FGG676I?
The XC2VP20-5FGG676I offers a combination of programmable logic density, embedded memory, high I/O count, and family-level support for multi-gigabit transceivers and embedded PowerPC processors. Its industrial temperature rating and RoHS compliance make it suitable for demanding embedded and communications systems that require long-term robustness.
This device is well suited for teams building systems that need integrated processing, flexible I/O, and on-chip memory resources while relying on comprehensive datasheet documentation for design and integration.
Request a quote or submit an inquiry to receive pricing and availability information for the XC2VP20-5FGG676I.

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