XC2VP20-5FG676C
| Part Description |
Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 404 1622016 20880 676-BGA |
|---|---|
| Quantity | 1,758 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BGA | Number of I/O | 404 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 2A (4 Weeks) | Number of LABs/CLBs | 2320 | Number of Logic Elements/Cells | 20880 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1622016 |
Overview of XC2VP20-5FG676C – Virtex®-II Pro FPGA, 676‑BGA
The XC2VP20-5FG676C is a commercial-grade Virtex®-II Pro field programmable gate array (FPGA) supplied by AMD. It delivers a high-density, platform-oriented FPGA fabric with on-chip memory, a substantial I/O complement and package options intended for complex embedded and communications designs.
As a Virtex‑II Pro family device, the part benefits from platform-level capabilities such as embedded processor block support and multi-gigabit transceiver technology (as described in the Virtex‑II Pro documentation), enabling system-level integration for applications that require programmable logic, significant I/O and embedded memory.
Key Features
- Programmable Logic Capacity Approximately 20,880 logic elements (cells) to implement custom digital logic and control functions.
- Embedded Memory Approximately 1.62 Mbits of on-chip RAM for buffering, state storage and local data processing.
- I/O Resources 404 user I/Os to support high-density interfacing and diverse signaling requirements.
- On‑Chip Processing & Transceivers (Platform-Level) Virtex‑II Pro platform documentation describes support for up to two PowerPC processor blocks and up to twenty RocketIO multi-gigabit transceivers for embedded processing and high-speed serial links.
- Dedicated DSP Primitives Family-level features include dedicated 18‑bit × 18‑bit multiplier blocks for arithmetic acceleration and DSP tasks.
- Clock and I/O Technologies Platform references include high-performance clock management circuitry, digitally controlled impedance (DCI) and SelectI/O technology for flexible I/O timing and signal integrity options.
- Package & Mounting 676‑BGA in a 676‑FBGA (27 × 27) footprint, surface-mount package suitable for dense PCB integration.
- Power & Thermal Nominal core supply range: 1.425 V to 1.575 V; commercial operating temperature: 0 °C to 85 °C.
- Regulatory RoHS compliant.
Typical Applications
- Telecommunications & Datacom Use the Virtex‑II Pro platform transceiver support and dense logic to implement serial link aggregation, protocol bridging and packet processing functions.
- Embedded Processing Combine on-chip processor block support with programmable logic and memory for system-on-chip style designs and real-time control functions.
- Video & Signal Processing Leverage the device's logic density, embedded RAM and multiplier resources for image processing, filtering and custom acceleration tasks.
- High‑I/O Interface Aggregation 404 I/Os enable consolidation of parallel interfaces, sensor clusters or mixed-signal front ends onto a single FPGA fabric.
Unique Advantages
- High Logic Density: About 20,880 logic elements provide the capacity to integrate multiple functions or replace several discrete components in a single programmable device.
- Significant On‑Chip Memory: Approximately 1.62 Mbits of embedded RAM reduces external memory dependency for many buffering and stateful processing tasks.
- Extensive I/O Count: 404 user I/Os allow flexible routing and direct interfacing to numerous peripherals, sensors and buses without additional I/O expanders.
- Platform-Level Integration: Virtex‑II Pro family features for embedded processors and RocketIO transceivers enable tighter system integration where available in the family implementation.
- Commercial Temperature Range: Specified for 0 °C to 85 °C operation to match standard commercial embedded environments.
- RoHS Compliant: Meets common environmental requirements for lead-free assemblies.
Why Choose XC2VP20-5FG676C?
The XC2VP20-5FG676C provides a balance of programmable logic capacity, embedded memory and a large I/O count in a compact 676‑BGA package, making it well suited for developers building complex embedded systems, communications interfaces and signal-processing applications. Its platform-level features (as documented for the Virtex‑II Pro family) support designs that can benefit from integrated processor blocks and multi-gigabit transceiver technology.
For teams seeking a commercially graded FPGA with clear power, thermal and packaging specifications, the XC2VP20-5FG676C offers a documented foundation for board-level integration and system prototyping where Virtex‑II Pro family capabilities are required.
Request a quote or submit a pricing inquiry to evaluate the XC2VP20-5FG676C for your next design.

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