XC2VP20-5FG676C

IC FPGA 404 I/O 676FCBGA
Part Description

Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 404 1622016 20880 676-BGA

Quantity 1,758 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case676-BGANumber of I/O404Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level2A (4 Weeks)Number of LABs/CLBs2320Number of Logic Elements/Cells20880
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1622016

Overview of XC2VP20-5FG676C – Virtex®-II Pro FPGA, 676‑BGA

The XC2VP20-5FG676C is a commercial-grade Virtex®-II Pro field programmable gate array (FPGA) supplied by AMD. It delivers a high-density, platform-oriented FPGA fabric with on-chip memory, a substantial I/O complement and package options intended for complex embedded and communications designs.

As a Virtex‑II Pro family device, the part benefits from platform-level capabilities such as embedded processor block support and multi-gigabit transceiver technology (as described in the Virtex‑II Pro documentation), enabling system-level integration for applications that require programmable logic, significant I/O and embedded memory.

Key Features

  • Programmable Logic Capacity  Approximately 20,880 logic elements (cells) to implement custom digital logic and control functions.
  • Embedded Memory  Approximately 1.62 Mbits of on-chip RAM for buffering, state storage and local data processing.
  • I/O Resources  404 user I/Os to support high-density interfacing and diverse signaling requirements.
  • On‑Chip Processing & Transceivers (Platform-Level)  Virtex‑II Pro platform documentation describes support for up to two PowerPC processor blocks and up to twenty RocketIO multi-gigabit transceivers for embedded processing and high-speed serial links.
  • Dedicated DSP Primitives  Family-level features include dedicated 18‑bit × 18‑bit multiplier blocks for arithmetic acceleration and DSP tasks.
  • Clock and I/O Technologies  Platform references include high-performance clock management circuitry, digitally controlled impedance (DCI) and SelectI/O technology for flexible I/O timing and signal integrity options.
  • Package & Mounting  676‑BGA in a 676‑FBGA (27 × 27) footprint, surface-mount package suitable for dense PCB integration.
  • Power & Thermal  Nominal core supply range: 1.425 V to 1.575 V; commercial operating temperature: 0 °C to 85 °C.
  • Regulatory  RoHS compliant.

Typical Applications

  • Telecommunications & Datacom  Use the Virtex‑II Pro platform transceiver support and dense logic to implement serial link aggregation, protocol bridging and packet processing functions.
  • Embedded Processing  Combine on-chip processor block support with programmable logic and memory for system-on-chip style designs and real-time control functions.
  • Video & Signal Processing  Leverage the device's logic density, embedded RAM and multiplier resources for image processing, filtering and custom acceleration tasks.
  • High‑I/O Interface Aggregation  404 I/Os enable consolidation of parallel interfaces, sensor clusters or mixed-signal front ends onto a single FPGA fabric.

Unique Advantages

  • High Logic Density:  About 20,880 logic elements provide the capacity to integrate multiple functions or replace several discrete components in a single programmable device.
  • Significant On‑Chip Memory:  Approximately 1.62 Mbits of embedded RAM reduces external memory dependency for many buffering and stateful processing tasks.
  • Extensive I/O Count:  404 user I/Os allow flexible routing and direct interfacing to numerous peripherals, sensors and buses without additional I/O expanders.
  • Platform-Level Integration:  Virtex‑II Pro family features for embedded processors and RocketIO transceivers enable tighter system integration where available in the family implementation.
  • Commercial Temperature Range:  Specified for 0 °C to 85 °C operation to match standard commercial embedded environments.
  • RoHS Compliant:  Meets common environmental requirements for lead-free assemblies.

Why Choose XC2VP20-5FG676C?

The XC2VP20-5FG676C provides a balance of programmable logic capacity, embedded memory and a large I/O count in a compact 676‑BGA package, making it well suited for developers building complex embedded systems, communications interfaces and signal-processing applications. Its platform-level features (as documented for the Virtex‑II Pro family) support designs that can benefit from integrated processor blocks and multi-gigabit transceiver technology.

For teams seeking a commercially graded FPGA with clear power, thermal and packaging specifications, the XC2VP20-5FG676C offers a documented foundation for board-level integration and system prototyping where Virtex‑II Pro family capabilities are required.

Request a quote or submit a pricing inquiry to evaluate the XC2VP20-5FG676C for your next design.

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