XC2VP20-5FGG676C

The XC2VP20-5FGG676C is a Virtex®-II Pro FPGA from AMD, delivered in a 676-ball BGA package optimized for surface-mount assembly. It provides high logic density and on-chip memory suitable for demanding embedded and communications-focused designs that require abundant I/O and reconfigurable logic.

As a member of the Virtex-II Pro family, this device benefits from platform-level features documented in the family datasheet, including optional embedded processor blocks and multi-gigabit transceiver support. The device targets applications that need flexible, high-capacity programmable logic combined with substantial on-chip RAM and I/O resources.

Key Features

• Logic Capacity — 2,320 CLBs providing approximately 20,880 logic elements for implementing complex custom logic and state machines.
• Embedded Memory — Approximately 1.62 Mbits of total on-chip RAM for buffers, FIFOs and embedded data storage.
• I/O Count — 404 user I/O pins to support wide parallel interfaces and dense peripheral connectivity.
• Package & Mounting — 676-ball BGA (supplier package: 676-FBGA, 27×27) in a surface-mount footprint for compact board-level integration.
• Power & Thermal — Core supply range 1.425 V to 1.575 V; commercial temperature grade rated 0°C to 85°C.
• Environmental Compliance — RoHS compliant, supporting regulatory requirements for lead-free assembly.
• Virtex-II Pro Family Capabilities — Family-level features include support for embedded PowerPC™ processor blocks, RocketIO™ multi-gigabit transceivers, dedicated 18×18 multipliers, SelectRAM™ memory hierarchy, digital clock management (DCM), and SelectI/O™-Ultra technology (refer to family datasheet for details).

Typical Applications

• Telecom & Datacom — Implement protocol processing, packet buffering and high-density I/O functions where large embedded memory and extensive I/O are required.
• Embedded Processor Systems — Integrate custom peripherals and logic around embedded processor cores (family-level feature) for networked or control applications.
• High-Speed Serial Interfaces — Leverage family transceiver support for multi-gigabit links and protocol bridging in communication equipment.
• Signal Processing & Acceleration — Use on-chip RAM and dedicated multiplier resources for real-time DSP, filtering and hardware acceleration tasks.

Unique Advantages

• High integration density: Combines thousands of logic elements with over a megabit of embedded RAM to reduce board-level component count and simplify system architecture.
• Substantial I/O capability: 404 I/O pins enable broad connectivity to peripherals, memory interfaces and parallel buses without external I/O expanders.
• Compact BGA package: 676-FBGA (27×27) provides a small PCB footprint while delivering high pin count for dense designs.
• Commercial temperature rating: 0°C to 85°C grade suitable for a wide range of commercial and enterprise applications.
• Comprehensive documentation: Supported by the Virtex-II Pro family datasheet series, which includes detailed architecture, electrical characteristics and pinout information for system-level design.
• RoHS compliant: Facilitates lead-free manufacturing and regulatory compliance for modern assembly processes.

Why Choose XC2VP20-5FGG676C?

The XC2VP20-5FGG676C delivers a balanced combination of logic capacity, embedded memory and high I/O density in a compact 676-BGA package. It is well suited for developers building communications equipment, embedded compute platforms and hardware-accelerated signal processing systems that require flexible, reprogrammable logic and substantial on-chip resources.

Backed by comprehensive family-level documentation, this Virtex-II Pro device offers a clearly defined feature set and integration path for designs that benefit from a platform FPGA approach—providing scalability and robust capability for medium- to high-complexity applications.

Request a quote or submit a pricing inquiry today to check availability and lead times for XC2VP20-5FGG676C.