XC2VP20-6FFG1152C

The XC2VP20-6FFG1152C is a Virtex®-II Pro field programmable gate array (FPGA) IC from AMD in a 1152-ball FCBGA package. It delivers high logic density and I/O capacity for complex embedded and high-performance designs, with supply and thermal ranges suitable for commercial applications.

Key architecture attributes include 20,880 logic elements and approximately 1.62 Mbits of embedded RAM, plus a high I/O count and a compact surface-mount FCBGA footprint, making the device suitable for system designs that require dense programmable logic and extensive board interfacing.

Key Features

• Logic Capacity — 20,880 logic elements for implementing complex custom logic, state machines, and control functions.
• Embedded Memory — Approximately 1.62 Mbits of total on-chip RAM to support buffering, packet storage, and intermediate data processing.
• I/O Density — 564 user I/O pins to accommodate wide parallel interfaces, memory buses, and multiple peripheral connections.
• Package & Mounting — 1152-FCBGA (35×35) package, surface-mount for compact board integration and high-pin-count routing.
• Power Supply — Core supply range 1.425 V to 1.575 V to match system power-rail design.
• Operating Range — Commercial temperature grade (0 °C to 85 °C) for general-purpose applications.
• Standards & Compliance — RoHS compliant for regulatory and assembly considerations.
• Virtex‑II Pro Platform Features (per series datasheet) — The Virtex‑II Pro family documentation describes embedded platform capabilities such as RocketIO multi‑gigabit transceivers, PowerPC processor block support, dedicated 18×18 multipliers, and advanced clock management circuitry.

Typical Applications

• Telecommunications & Networking — High I/O counts and Virtex‑II Pro series transceiver and timing features (per datasheet) support protocol bridging, packet processing, and interface aggregation.
• Embedded Processing & Control — Large logic capacity and on-chip RAM enable custom control engines, protocol stacks, and co-processor functions.
• Signal Processing & Data Acquisition — Dedicated multiplier blocks and block RAM (as described in the family datasheet) make the device suitable for filtering, DSP kernels, and intermediate buffering.
• Prototyping & High-Density Logic — Compact FCBGA package and substantial logic resources support board-level prototypes and densely packed FPGA-based subsystems.

Unique Advantages

• High Logic and Memory Integration: 20,880 logic elements combined with approximately 1.62 Mbits of embedded RAM reduce external component needs for many designs.
• Very High I/O Count: 564 I/Os enable multiple parallel interfaces and rich connectivity without complex external multiplexing.
• Compact, High-Pin Package: The 1152-FCBGA (35×35) package delivers a dense pinout for high-performance, space-constrained boards.
• Commercial Temperature Grade: Rated 0 °C to 85 °C to match a wide range of general-purpose applications and environments.
• RoHS Compliance: Conforms to RoHS requirements for modern assembly and environmental standards.
• Platform-Level Feature Set: Virtex‑II Pro family capabilities (per the series datasheet) such as embedded transceivers, processor block support, and high-performance clock management help address complex system requirements.

Why Choose XC2VP20-6FFG1152C?

The XC2VP20-6FFG1152C positions itself for designs that need substantial programmable logic, embedded RAM, and a high number of I/Os in a compact FCBGA package. Its power and thermal specifications align with commercial-grade system requirements, and RoHS compliance simplifies manufacturing and regulatory handling.

Designed for engineers building communication, embedded processing, and high-density logic applications, this Virtex‑II Pro device provides a platform-level feature set documented in the family datasheet while offering the on-chip resources needed to consolidate functions and streamline board design.

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