XC2VP30-6FFG1152I

The XC2VP30-6FFG1152I is an industrial-grade Virtex®-II Pro field programmable gate array supplied in a 1152-ball flip-chip BGA package. Built on the Virtex-II Pro platform architecture, the device targets designs that require high logic density, substantial on-chip memory, and a large number of user I/Os for complex embedded and I/O‑intensive systems.

The device offers a clear hardware foundation for applications needing approximately 30,816 logic elements, roughly 2.5 Mbits of embedded RAM, and up to 644 I/Os, with an extended operating range and RoHS compliance to support industrial deployments.

Key Features

• Logic Resources  Approximately 30,816 logic elements support complex combinational and sequential logic implementations for custom acceleration and control functions.
• Embedded Memory  Approximately 2.5 Mbits of on-chip RAM provides local storage for buffering, lookup tables, and state retention without relying exclusively on external memory.
• I/O Capacity  Up to 644 user I/Os enable wide parallel interfaces and high-density connections to peripherals, sensors, and board-level buses.
• Platform Architecture  Based on the Virtex-II Pro platform technology; family-level features include options for embedded multi-gigabit transceivers (RocketIO) and up to two PowerPC processor blocks, along with dedicated 18-bit × 18-bit multiplier resources and digital clock management circuitry.
• Package and Mounting  1152-ball FCBGA package (35 × 35 mm) designed for surface-mount assembly to maximize I/O count in a compact footprint.
• Power Supply  Supported core supply range from 1.425 V to 1.575 V for the FPGA core rails.
• Environmental and Reliability  Industrial-grade device with an operating temperature range of −40°C to 100°C and RoHS compliance for regulatory alignment.

Typical Applications

• Telecommunications & Networking  Leverages Virtex-II Pro platform transceiver and clocking features to implement high-bandwidth data paths and protocol processing in network equipment.
• Embedded Processing  Suitable for designs that combine programmable logic with embedded processor resources available in the Virtex-II Pro family for control, offload, or system management tasks.
• High‑Density I/O Systems  Ideal for applications requiring extensive parallel interfacing—such as data-acquisition front ends, switch fabrics, and interface bridging—using up to 644 I/Os.
• Industrial Control  Industrial-grade temperature range and robust packaging support factory automation, motor control, and machine-vision controllers operating in demanding environments.

Unique Advantages

• High Logic Density: Approximately 30,816 logic elements enable implementation of complex state machines, DSP pipelines, and custom accelerators on a single device.
• Significant On‑Chip Memory: Approximately 2.5 Mbits of embedded RAM reduces dependence on external memory for buffering and lookup tables, simplifying board design.
• Extensive I/O Count: Up to 644 I/Os provide flexibility for parallel interfaces and mixed-signal front-ends, reducing the need for external multiplexing logic.
• Platform-Level Integration: Built on the Virtex-II Pro platform, offering architectural features such as RocketIO transceivers, PowerPC processor support, dedicated multipliers, and advanced clock management to accelerate system implementation.
• Industrial Temperature and RoHS Compliance: −40°C to 100°C operating range and RoHS compliance support wide deployment scenarios with environmental and regulatory considerations addressed.
• Compact High‑Pin Package: 1152-FCBGA (35×35 mm) package enables high I/O density in a compact form factor suitable for board-level space-constrained designs.

Why Choose XC2VP30-6FFG1152I?

The XC2VP30-6FFG1152I combines high logic and memory resources with a large I/O complement and industrial-grade operating conditions, making it well suited for complex embedded systems and I/O-heavy applications. Its foundation on the Virtex-II Pro platform brings family-level architectural advantages that help streamline integration of high-performance interfaces and embedded processing where required.

This device is aimed at engineering teams and procurement departments seeking a proven FPGA solution with substantial on-chip resources, broad I/O capability, and the environmental range needed for industrial deployments—delivering a scalable hardware building block for mid-to-high complexity designs.

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