XC2VP30-6FFG1152C

The XC2VP30-6FFG1152C is a Virtex®-II Pro platform FPGA provided in a 1152-ball FCBGA package. It delivers a high-density programmable fabric with a large I/O count and substantial embedded memory, designed for commercial embedded systems and communications applications.

Built on the Virtex-II Pro platform, this device combines configurable logic, on-chip RAM, and platform-level features documented in the Virtex-II Pro family data to support complex system integration where high I/O, logic density, and integration of processing and transceiver resources are required.

Key Features

• Logic Capacity — 3,424 configurable logic block (CLB) units and 30,816 logic cells provide a high-density programmable fabric for complex logic implementations.
• Embedded Memory — Approximately 2.5 Mbits of on-chip RAM (2,506,752 total RAM bits) for buffering, FIFOs and tightly-coupled memory requirements.
• I/O Density — 644 user I/O pins accommodate wide parallel interfaces, high-pin-count peripherals, and dense board-level connectivity.
• Processor Integration (Family) — Virtex-II Pro family documentation includes support for up to two IBM PowerPC™ 405 processor blocks, enabling embedded processing integration where needed.
• High-Speed Serial (Family) — Family-level support for RocketIO™ multi-gigabit transceivers (up to twenty on some devices) for high-speed serial links and telecom/datacom modes.
• DSP and Arithmetic Resources (Family) — Dedicated 18-bit × 18-bit multiplier blocks are part of the platform feature set for arithmetic- and DSP-oriented functions.
• Clocking and Timing (Family) — High-performance clock management circuitry and Digital Clock Manager (DCM) features are documented for the Virtex-II Pro platform.
• Package & Mounting — Supplied in a 1152-BBGA (1152-FCBGA, 35×35) surface-mount package for board-level assembly.
• Power — Core supply voltage range of 1.425 V to 1.575 V for device operation.
• Operating Range & Grade — Commercial grade device rated for operation from 0 °C to 85 °C.
• Environmental Compliance — RoHS-compliant to support current environmental requirements.

Typical Applications

• Telecom & Datacom Systems — Family-level RocketIO serial transceiver support and high I/O density make this device suitable for networking line cards and backplane interfaces that require high-speed serial connectivity.
• Embedded Processing Platforms — On-chip PowerPC processor blocks (as documented for the Virtex-II Pro family) enable integration of control and application-level processing with custom hardware acceleration.
• High-Density Logic and Glue — Large logic cell count and abundant I/O support complex glue logic, protocol bridging, and prototype ASIC replacement in commercial embedded designs.
• DSP and Signal Processing — Dedicated multiplier blocks and substantial block RAM capacity support fixed-function or configurable DSP tasks within commercial temperature ranges.

Unique Advantages

• High integration density: 30,816 logic cells and approximately 2.5 Mbits of embedded RAM reduce the need for external memory and discrete logic, simplifying board designs.
• Extensive I/O capacity: 644 I/O pins provide flexibility for multiple parallel interfaces and board-level connectivity without additional bridging components.
• Platform-level processor and transceiver support: Virtex-II Pro family features include embedded PowerPC cores and RocketIO transceivers for combined processing and high-speed serial functionality when system designs require them.
• Commercial temperature and RoHS compliance: Commercial-grade operating range (0 °C to 85 °C) and RoHS compliance support standard commercial product lifecycles and environmental requirements.
• Standard FCBGA package: The 1152-ball FCBGA (35×35) package provides a compact, surface-mount solution for space-constrained PCB designs.
• Comprehensive documentation: Family datasheet modules include architecture, functional descriptions, DC and switching characteristics, and pinout information to aid system integration and design validation.

Why Choose XC2VP30-6FFG1152C?

The XC2VP30-6FFG1152C brings together substantial logic density, significant on-chip memory, and a high I/O count in a compact 1152-ball FCBGA package for commercial embedded designs. As part of the Virtex-II Pro platform, it benefits from documented platform features—such as processor integration and multi-gigabit transceiver support—backed by detailed datasheet modules and IP/core references to accelerate system development.

This device is well suited to design teams needing a high-density, commercially rated FPGA with broad I/O capability and embedded memory for applications spanning communications, embedded processing, and advanced glue/DSP functions, while maintaining compliance with RoHS requirements.

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