XC2VP4-5FFG672C

The XC2VP4-5FFG672C is a Virtex®-II Pro field programmable gate array supplied in a 672-ball flip-chip BGA (27×27) package. Built on the Virtex-II Pro platform, the family offers a high-performance FPGA architecture with on-chip memory, a large I/O count, and platform-level features such as multi-gigabit transceiver support and embedded processor block options.

This device targets applications that require dense I/O, significant on-chip RAM, and platform-level integration, delivered in a surface-mount 672-FCBGA package with commercial-grade temperature and RoHS compliance.

Key Features

• FPGA Core Platform Virtex-II Pro platform architecture providing flexible, SRAM-based in-system configuration and dedicated logic resources.
• Logic Capacity 6,768 logic elements to implement custom digital functions and control logic.
• On-Chip Memory Approximately 0.516 Mbits (516,096 bits) of on-chip RAM for data buffering, state storage, and small memory structures.
• I/O Density 348 I/O pins enable high-density external interfacing for parallel buses, control signals, and mixed-signal front-ends.
• Package and Mounting 672-ball FCBGA (672-BBGA) 27×27 package in a surface-mount form factor for compact board integration.
• Power and Temperature Core supply voltage range of 1.425 V to 1.575 V and commercial operating temperature range of 0 °C to 85 °C.
• Platform-Level Capabilities Family-level features include support for RocketIO/RocketIO X multi-gigabit transceivers and up to two IBM PowerPC RISC processor blocks, as described in the Virtex-II Pro series documentation.
• Environmental Compliance RoHS compliant for alignment with common environmental and procurement requirements.

Typical Applications

• Telecom / Datacom systems — The Virtex-II Pro platform documentation cites support for RocketIO multi-gigabit transceivers and telecom/datacom modes, making the device suitable where serial links and protocol handling are required.
• Embedded processing platforms — Platform-level support for up to two PowerPC RISC processor blocks allows integration of embedded control or offload processors within FPGA-based systems.
• High-density I/O control — With 348 I/O pins and significant on-chip RAM, the device is appropriate for designs needing broad external interfacing and local buffering.

Unique Advantages

• High integration in a compact package: 672-ball FCBGA (27×27) combines a large I/O count and logic capacity in a surface-mount footprint to reduce board area.
• Substantial on-chip RAM: Approximately 0.516 Mbits of RAM enables local data storage and buffering without immediate external memory dependency.
• Platform extensibility: The Virtex-II Pro family provides platform-level features such as multi-gigabit transceiver support and processor-block options to simplify system-level integration.
• Design-grade electrical envelope: Defined core voltage range (1.425 V–1.575 V) helps when planning power delivery and sequencing for reliable operation.
• Commercial temperature rating: 0 °C to 85 °C operation suited for a wide range of commercial electronic systems.
• RoHS compliant: Facilitates procurement and regulatory alignment for environmentally conscious designs.

Why Choose XC2VP4-5FFG672C?

The XC2VP4-5FFG672C positions itself as a compact, platform-capable FPGA option within the Virtex-II Pro family, offering a balance of logic capacity, on-chip memory, and high I/O density in a 672-FCBGA package. Its specified core voltage window and commercial temperature rating make it suitable for commercially focused embedded and communications designs where platform-level features and integration matter.

Designers seeking a device with proven Virtex-II Pro platform characteristics—such as multi-gigabit transceiver and embedded processor block support at the family level—will find this part appropriate for consolidating functions, reducing external components, and streamlining system architecture.

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