XC2VP4-6FG256I

The XC2VP4-6FG256I is an industrial-grade Virtex®-II Pro Field Programmable Gate Array provided by AMD. Built on the Virtex-II Pro platform, this device combines configurable logic, embedded memory, and a broad set of system-level features from the Virtex-II Pro family to address applications that require on-chip processing, high I/O density, and flexible interfacing.

This device is suited for markets such as telecommunications, industrial control and embedded processing where a compact 256-ball BGA package, 140 I/O pins, and a wide operating temperature range are required.

Key Features

• Logic Capacity — 752 CLBs and 6,768 logic elements for implementing custom logic and state machines.
• Embedded Memory — Approximately 0.516 Mbits of on-chip RAM (516,096 bits) for data buffering and local storage.
• I/O and Package — 140 user I/O pins in a surface-mount 256-BGA (256-FBGA, 17 × 17) package for compact board integration.
• Power — Core supply operating range from 1.425 V to 1.575 V for predictable power design.
• Thermal Range — Industrial operating temperature from −40°C to 100°C for harsh-environment deployment.
• Platform Capabilities (Virtex-II Pro family) — Family-level features include support for embedded PowerPC™ processor blocks, RocketIO™ multi-gigabit transceiver technology, dedicated 18-bit × 18-bit multiplier blocks, and advanced clock management circuitry.
• Mounting and Compliance — Surface mount package and RoHS compliant for modern assembly and environmental requirements.

Typical Applications

• Telecommunications & Datacom — Use the Virtex-II Pro family transceiver and high-density logic to implement protocol bridging, line cards, or packet processing functions.
• Embedded Processing — Integrate on-chip processor blocks and custom peripherals for control and signal-processing tasks within compact systems.
• Industrial Control — Deploy in factory automation and motion-control systems where industrial temperature range and robust I/O counts are required.
• High‑performance Prototyping — Leverage the FPGA’s logic capacity and embedded memory for hardware validation and rapid prototyping of digital subsystems.

Unique Advantages

• Integrated system capability: Logic, on-chip RAM, and family support for embedded processor blocks reduce external component count and simplify system design.
• High I/O density in a compact footprint: 140 I/O pins in a 256-BGA (17 × 17) package enable feature-rich designs without a large PCB area penalty.
• Industrial temperature qualification: Operation from −40°C to 100°C supports deployment in demanding environments.
• Predictable power domain: A defined core voltage range (1.425 V–1.575 V) aids power-supply and thermal planning.
• Environmentally compliant: RoHS compliance aligns with modern manufacturing and regulatory requirements.

Why Choose XC2VP4-6FG256I?

The XC2VP4-6FG256I positions itself as a compact, industrial-grade member of the Virtex-II Pro family that brings together a moderate logic capacity, substantial embedded RAM, and a broad I/O complement in a 256-ball BGA package. Its electrical and thermal specifications make it suitable for embedded systems that require on-chip resources and robust operation across a wide temperature range.

This device is well suited for engineers and procurement teams designing industrial control, telecom interfaces, and embedded processing modules where platform-level FPGA features and RoHS compliance are required.

Request a quote or submit your requirements to receive pricing and availability for the XC2VP4-6FG256I. Our team can provide lead-time information and support material to help you evaluate the device for your design.