XC2VP4-6FGG256C

The XC2VP4-6FGG256C is a Virtex®-II Pro FPGA from AMD offered in a 256-ball BGA package. It combines programmable logic, on-chip embedded memory, and a broad I/O count in a commercial-grade, surface-mount form factor for embedded and system-level applications.

Designed for engineers who need a balanced mix of logic capacity, memory and I/O in a compact package, this device is suited for applications that require mid-range programmable logic and a predictable supply and thermal profile.

Key Features

• Logic Resources — 752 configurable logic blocks (CLBs) providing 6,768 logic elements (cells), enabling mid-density programmable logic implementations.
• Embedded Memory — Approximately 0.52 Mbits (516,096 bits) of on-chip RAM for buffering, FIFOs, and local storage.
• I/O Integration — 140 general-purpose I/O pins to support multiple interfaces and board-level connectivity.
• Package & Mounting — 256-BGA supplied as a 256-FBGA (17×17) package, optimized for surface-mount assembly and compact board layouts.
• Power — Core voltage supply range of 1.425 V to 1.575 V to match system power rails and regulator designs.
• Operating Range — Commercial operating temperature from 0 °C to 85 °C for standard electronics environments.
• Environmental Compliance — RoHS compliant for lead-free manufacturing requirements.
• Manufacturer — AMD device with documented Virtex®-II Pro family architecture and supporting documentation.

Typical Applications

• Embedded Systems — Implement custom control logic, glue logic, and protocol handling using the device's programmable logic and embedded RAM.
• Communications Modules — Support for board-level interface aggregation and custom data-path logic using the device's I/O count and on-chip memory.
• Industrial Control — Mid-density logic implementations for sensor aggregation, motor control support logic, and real-time interfacing within commercial temperature ranges.
• Prototyping and Development — Suitable for proof-of-concept and mid-complexity FPGA designs that require a compact BGA package and accessible logic/memory resources.

Unique Advantages

• Balanced Logic and Memory: 6,768 logic elements paired with approximately 0.52 Mbits of embedded RAM provide a versatile resource mix for a range of mid-complexity designs.
• High I/O Count in Compact Package: 140 I/Os in a 256-FBGA (17×17) footprint enable dense board-level connectivity without a large package.
• Predictable Power Envelope: Defined core voltage range (1.425 V–1.575 V) simplifies power-supply selection and regulator design.
• Commercial Temperature Rating: Operates across 0 °C–85 °C, matching typical commercial electronics deployment environments.
• RoHS Compliant: Meets lead-free manufacturing requirements for modern production processes.

Why Choose XC2VP4-6FGG256C?

The XC2VP4-6FGG256C provides a practical, mid-density Virtex®-II Pro FPGA solution that balances logic capacity, embedded memory and I/O in a compact BGA package. Its defined voltage and temperature ranges, combined with RoHS compliance, make it suitable for commercial embedded and system designs that require stable, documented FPGA resources.

This part is appropriate for design teams and procurement professionals seeking a predictable, mid-range FPGA platform for prototyping, communications interface logic, and embedded control functions where a compact package and moderate on-chip resources are the priority.

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