XC2VP4-6FGG456C

The XC2VP4-6FGG456C is a Virtex-II Pro field programmable gate array (FPGA) in a 456-ball BGA package from AMD. It provides a balanced combination of configurable logic, embedded memory, and high I/O density for system-level integration in communications and embedded applications.

Built on the Virtex-II platform, the device targets designs that require flexible on-chip resources, significant I/O capacity, and compatibility with the Virtex-II Pro family feature set for high-performance system implementations.

Key Features

• Configurable Logic 6,768 logic elements and 752 configurable logic blocks (CLBs) enable implementation of custom digital functions and mid-scale logic integration.
• Embedded Memory Approximately 0.52 Mbits of embedded memory (516,096 total RAM bits) to support on-chip buffering, FIFOs and state storage.
• High I/O Count 248 user I/O pins suitable for connecting multiple peripherals, buses and system interfaces.
• Power Supply Operates from a core supply range of 1.425 V to 1.575 V to match system power rails and regulator choices.
• Package & Mounting 456-BBGA (supplier package 456-FBGA, 23 × 23 mm) in a surface-mount form factor for high-density PCB assembly.
• Operating Conditions Commercial temperature grade with operating range 0 °C to 85 °C and RoHS compliance for environmental compatibility.
• Virtex-II Pro Platform Features (family-level) Family-level capabilities include multi-gigabit RocketIO transceiver options, up to two PowerPC RISC processor blocks, dedicated 18 × 18 multipliers, SelectRAM+ memory hierarchy, digitally controlled impedance (DCI) I/O and digital clock management (as defined by the Virtex-II Pro family specification).

Typical Applications

• Telecom / Datacom Equipment Supports high-density I/O and family-level multi-gigabit transceiver capabilities for networking, switching and transport equipment.
• Embedded Processing Systems Suitable for designs that leverage on-chip logic and memory together with the Virtex-II Pro family’s embedded processor options for system control and protocol handling.
• System Integration & Prototyping Useful as a glue and integration FPGA for bridging interfaces, implementing custom protocols and validating system-level architectures.

Unique Advantages

• Balanced logic and memory Combination of 6,768 logic elements and approximately 0.52 Mbits of embedded memory lets you implement both control logic and data buffering on-chip.
• High I/O density 248 I/O pins reduce external interface complexity and simplify board-level routing for multi-peripheral systems.
• Compact BGA footprint 456-ball BGA (23 × 23 mm supplier package) enables high-density PCB designs while maintaining surface-mount manufacturability.
• Commercial-grade reliability 0 °C to 85 °C operating range and RoHS compliance align with standard commercial product requirements.
• Family-level integration options Access to Virtex-II Pro family capabilities—such as RocketIO transceivers, PowerPC cores, dedicated multipliers and clock management—helps scale designs within the same platform.

Why Choose XC2VP4-6FGG456C?

XC2VP4-6FGG456C delivers a practical balance of logic resources, embedded memory and high I/O count in a compact BGA package, making it well suited for commercial embedded systems, telecom/datacom modules and integration-focused designs. Its compatibility with Virtex-II Pro family capabilities provides options for serial transceivers and embedded processing when required by the system architecture.

This device is appropriate for engineers seeking a configurable, mid-range FPGA that integrates essential on-chip resources and supports robust PCB-level integration while meeting commercial temperature and environmental standards.

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