XC2VP40-5FF1152C

The XC2VP40-5FF1152C is a Virtex®-II Pro platform FPGA manufactured by AMD. It combines a high logic capacity with substantial embedded memory, a large I/O count and on-chip processor/transceiver resources for applications that require integration of programmable logic, memory and high-speed serial interfaces.

This device targets communications and embedded processing applications where performance, integration and flexible I/O routing matter most. The architecture provides embedded processor block support, multi-gigabit transceiver capability and dedicated DSP resources while operating within a commercial temperature range.

Key Features

• Logic Capacity  Approx. 43,632 logic elements suitable for complex control, glue logic and custom datapath implementations.
• Embedded Memory  Approximately 3.54 Mbits of on-chip RAM for buffers, FIFOs and local data storage.
• I/O Density  692 I/O pins to support wide parallel interfaces, bus bridging and extensive peripheral connectivity.
• Processor & Transceiver Support  Series-level features include support for embedded PowerPC processor blocks and RocketIO/RocketIO X multi-gigabit transceivers for serial link integration.
• DSP Resources  Dedicated 18-bit × 18-bit multiplier blocks (series feature) to accelerate arithmetic and signal-processing paths.
• Package & Mounting  1152-FCBGA (35×35) package; surface-mount mounting type for compact board-level integration.
• Power Supply  Core supply range: 1.425 V to 1.575 V to match system power-rail requirements.
• Operating Range & Compliance  Commercial grade operation from 0 °C to 85 °C; RoHS compliant.

Typical Applications

• Telecom & Datacom Systems  Integrate high-speed serial links and protocol bridging using on-chip multi-gigabit transceiver capability and configurable logic.
• Embedded Processing & Control  Deploy embedded PowerPC processor blocks alongside programmable logic for system control, protocol processing and real-time tasks.
• Signal Processing & Acceleration  Use dedicated multiplier blocks and abundant logic resources for fixed-point DSP, filtering and custom accelerators.
• High-Density I/O Systems  Support wide buses and many peripherals with 692 I/O pins for board-level integration and flexible interfacing.

Unique Advantages

• High logic density: Approx. 43,632 logic elements enable complex designs without external glue logic.
• Substantial on-chip memory: Approximately 3.54 Mbits of embedded RAM reduce dependence on external memory for buffering and local storage.
• Large I/O complement: 692 I/Os provide design flexibility for parallel interfaces, buses and mixed-signal front ends.
• Integrated serial and processor capabilities: Series-level support for RocketIO transceivers and PowerPC processor blocks simplifies system integration of serial links and embedded processing.
• Compact FCBGA package: 1152-FCBGA (35×35) package allows dense board integration while maintaining signal routing density.
• Standards-conscious design: RoHS compliance and a clearly specified commercial operating range support predictable manufacturability and deployments in commercial environments.

Why Choose XC2VP40-5FF1152C?

The XC2VP40-5FF1152C positions itself as a highly integrated FPGA choice when designers need a balance of logic capacity, embedded memory and extensive I/O in a single device. Its series-level architectural features—embedded processor blocks, multi-gigabit transceivers and dedicated DSP multipliers—enable consolidated system designs that minimize external components.

This device is well suited for teams developing communications equipment, embedded controllers and DSP-accelerated subsystems that require a mature platform with documented datasheet resources and IP/core references. The combination of on-chip memory, high I/O count and a compact FCBGA package delivers durable value across commercial-grade applications.

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