XC2VP40-5FFG1148C

The XC2VP40-5FFG1148C is a Virtex‑II Pro Field Programmable Gate Array in a 1148‑ball flip‑chip BGA package. It delivers a high logic density fabric with substantial embedded memory and a large I/O count for complex system designs.

Designed for commercial‑grade applications, this surface‑mount FPGA provides approximately 3.54 Mbits of on‑chip memory, 43,632 logic elements, and 804 user I/O pins, offering a compact, high‑capacity building block for embedded processing and high‑bandwidth interfaces.

Key Features

• Logic Capacity  Approximately 43,632 logic elements to implement complex custom logic, state machines, and datapaths.
• Embedded Memory  Approximately 3.54 Mbits of on‑chip RAM for buffering, FIFOs, and on‑chip data storage.
• I/O Density  804 user I/O pins for dense parallel interfaces, peripheral connectivity, and board‑level integration.
• Package & Mounting  1148‑BBGA (FCBGA) in a 1148‑FCPBGA supplier package (35 × 35 mm); surface‑mount mounting type for compact board layouts.
• Power Supply  Core supply range of 1.425 V to 1.575 V to meet system power requirements.
• Operating Grade  Commercial temperature range: 0 °C to 85 °C.
• Regulatory  RoHS compliant.
• Virtex‑II Pro Family Architecture (series features)  Family‑level capabilities include embedded processor block support and multi‑gigabit transceiver architecture as described in the Virtex‑II Pro documentation.

Typical Applications

• Telecom & Datacom  Leverages the Virtex‑II Pro family’s multi‑gigabit transceiver and clocking features for high‑speed serial links and protocol bridging.
• Embedded Processing Systems  Supports designs that pair FPGA fabric with embedded processor blocks for system‑on‑chip implementations and control tasks.
• High‑Density I/O and Memory Interfaces  High I/O count and substantial on‑chip RAM make the device suitable for complex data aggregation, buffering, and interface bridging tasks.

Unique Advantages

• High Logic Density:  43,632 logic elements enable large custom datapaths and control logic in a single device.
• Significant On‑Chip Memory:  Approximately 3.54 Mbits of RAM reduces dependence on external memory for many buffering and storage needs.
• Extensive I/O Count:  804 user I/Os simplify routing of parallel interfaces and board‑level integration without needing multiple devices.
• Compact FCBGA Package:  1148‑ball flip‑chip BGA (35 × 35 mm) balances high pin count with a compact PCB footprint.
• Commercial Temperature and RoHS Compliance:  Designed for commercial environments and meets RoHS requirements for regulatory compliance.
• Platform‑Level Flexibility:  As part of the Virtex‑II Pro family, the device benefits from platform features documented for this series, including embedded processor block and transceiver capabilities.

Why Choose XC2VP40-5FFG1148C?

XC2VP40-5FFG1148C positions itself as a high‑capacity Virtex‑II Pro FPGA suited for designs that require a combination of dense logic, sizeable embedded memory, and a large number of I/Os in a compact flip‑chip BGA package. Its power and temperature specifications support commercial applications that demand reliable, board‑level integration.

This device is well matched to teams building embedded processing platforms, high‑bandwidth communication interfaces, or complex custom logic where consolidating functions into a single FPGA reduces BOM and board complexity while preserving design flexibility within the Virtex‑II Pro family architecture.

Request a quote or submit a sales inquiry to learn about availability and pricing for the XC2VP40-5FFG1148C. Our team can provide lead‑time and procurement support for your design cycle.