XC2VP40-5FFG1148I
| Part Description |
Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 804 3538944 43632 1148-BBGA, FCBGA |
|---|---|
| Quantity | 743 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1148-FCPBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1148-BBGA, FCBGA | Number of I/O | 804 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 4848 | Number of Logic Elements/Cells | 43632 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3538944 |
Overview of XC2VP40-5FFG1148I – Virtex®-II Pro Field Programmable Gate Array (FPGA), 1148-BBGA FCBGA
The XC2VP40-5FFG1148I is a Virtex®-II Pro Field Programmable Gate Array (FPGA) IC from AMD designed for high-density, configurable digital logic integration. It combines a large logic capacity with substantial embedded RAM and extensive I/O to address demanding embedded, communications, and system-integration applications.
Built on the Virtex-II Pro platform, the device supports platform-level features highlighted in the Virtex-II Pro family datasheet, and delivers a balance of programmable logic, embedded memory and I/O bandwidth for industrial-grade designs requiring broad configurability and sustained operation across a wide temperature range.
Key Features
- Large logic capacity — 43,632 logic elements for implementing complex digital designs and IP cores.
- Embedded memory — approximately 3.54 Mbits of on-chip RAM to support buffering, FIFOs and embedded data storage.
- Extensive I/O — 804 user I/O pins to support high-density peripheral interfaces and system interconnects.
- Platform capabilities — Virtex-II Pro family features include embedded multi-gigabit RocketIO transceivers and up to two IBM PowerPC RISC processor blocks as described in the product datasheet.
- Power supply — Operates from a core voltage range of 1.425 V to 1.575 V, enabling compatibility with precise power-rail designs.
- Package & mounting — 1148-BBGA FCBGA package (supplier package: 1148-FCPBGA, 35×35) in a surface-mount form factor for compact board integration.
- Industrial temperature grade — Rated for operation from −40°C to 100°C to meet demanding environmental requirements.
- RoHS compliant — Conforms to RoHS requirements for lead-free assembly and regulatory alignment.
Typical Applications
- Telecommunications and Datacom — Use the Virtex-II Pro platform features (including RocketIO transceiver support) to implement high-speed serial links, protocol processing and packet handling tasks.
- Embedded processing systems — Leverage the family’s embedded processor-block capability and abundant logic to integrate control and data-path functions on a single device.
- High-density I/O and interface aggregation — 804 I/O pins enable aggregation and bridging of multiple peripheral interfaces in communications or instrumentation equipment.
- Industrial automation and control — Industrial-grade temperature range and robust packaging suit real-world control systems requiring continuous operation across wide temperatures.
Unique Advantages
- High integration — Combines tens of thousands of logic elements with several Mbits of embedded RAM, reducing board-level component count and simplifying system architecture.
- Flexible I/O support — 804 I/O pins provide design flexibility for complex interface and mezzanine connectivity, minimizing external buffering needs.
- Platform-level building blocks — Access to Virtex-II Pro family features, such as RocketIO transceivers and embedded processor blocks, enables integration of high-speed serial and embedded compute functions.
- Industrial reliability — Specified for −40°C to 100°C operation and supplied in a surface-mount BBGA package suitable for production-grade assemblies.
- Regulatory alignment — RoHS compliance supports lead-free assembly workflows and environmental requirements.
Why Choose XC2VP40-5FFG1148I?
The XC2VP40-5FFG1148I delivers a compelling combination of large programmable logic capacity, embedded memory and extensive I/O in a production-ready FCBGA package. Its specification set supports system designs that require significant on-chip resources, high I/O density and operation across an industrial temperature range.
This device is appropriate for engineers and system integrators building communications equipment, embedded control platforms and high-density interface solutions who need platform-level features and a compact surface-mount package with RoHS compliance.
If you would like pricing or availability, request a quote or submit an inquiry to receive detailed purchasing information and lead-time options.

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