XC2VP40-5FF1152I

The XC2VP40-5FF1152I is a Virtex®-II Pro platform FPGA in a 1152-ball flip-chip BGA (35×35) package, designed for designs that require high logic density, abundant I/O, and embedded system resources. It integrates a rich FPGA fabric with industry-proven platform features to support high-speed serial interfaces, embedded processing, and on-chip memory.

Targeted at systems-level and industrial applications, this device provides flexible logic resources, multi-megabit embedded RAM, and a large number of I/O to address complex digital processing, communication, and embedded-control tasks.

Key Features

• Logic Fabric  4,848 configurable logic blocks (CLBs) providing approximately 43,632 logic elements for high-density digital design.
• Embedded Memory  Approximately 3.54 Mbits of on-chip RAM with 18-Kb Block SelectRAM resources and SelectRAM+ memory hierarchy for buffer and data storage.
• Embedded Multipliers  Dedicated 18-bit × 18-bit multiplier blocks for efficient DSP and arithmetic operations.
• High-Speed Serial and Embedded Processing  Family-level support for up to twenty RocketIO or RocketIO X multi-gigabit transceivers and up to two IBM PowerPC RISC processor blocks to enable embedded processing and high-speed serial links.
• Clock and I/O Management  Integrated digital clock management and SelectI/O™-Ultra technology plus XCITE digitally controlled impedance (DCI) I/O features for robust timing and signal integrity options.
• I/O Density  692 user I/Os to accommodate wide parallel interfaces, peripheral connections, and complex board-level routing.
• Package  1152-ball flip-chip BGA (1152-FCBGA, 35×35) providing a compact, high-pin-count footprint for system integration.
• Power and Temperature  Supply voltage range 1.425 V to 1.575 V and industrial operating temperature range of −40°C to 100°C.
• Compliance  RoHS compliant.

Typical Applications

• Telecom & Datacom systems  Leverages the platform’s multi-gigabit transceiver capabilities and clocking features for high-speed serial transport and protocol implementations.
• Embedded processing platforms  Uses the integrated PowerPC processor blocks alongside the FPGA fabric for hardware/software partitioning in control and signal-processing applications.
• High-density logic and DSP  Combines abundant CLBs, on-chip RAM, and 18×18 multipliers to implement complex DSP pipelines, packet processing, and custom silicon acceleration.
• Industrial control and automation  Industrial-grade temperature range and extensive I/O support system-level interfaces, sensor aggregation, and real-time control functions.

Unique Advantages

• High logic and memory integration: Combines thousands of CLBs with multiple megabits of embedded RAM to reduce external memory footprint and simplify board design.
• Integrated serial and processor resources: On-chip transceivers and PowerPC cores enable tighter system integration and lower BOM for embedded and communication subsystems.
• Robust I/O capacity: 692 I/Os accommodate diverse peripheral and bus interfaces without complex multiplexing or external I/O expanders.
• Industrial operating range: −40°C to 100°C rating supports deployment in demanding environments where temperature resilience is required.
• Compact, high-pin-count package: The 1152-FCBGA (35×35) package delivers high connectivity in a space-efficient footprint for dense PCB layouts.
• Standards-aware feature set: Platform-level features such as RocketIO transceivers, SelectI/O-Ultra, DCMs, and DCI support system designs that require controlled signaling and advanced timing.

Why Choose XC2VP40-5FF1152I?

The XC2VP40-5FF1152I delivers a balanced combination of high logic density, substantial embedded memory, extensive I/O, and platform features that address embedded processing and high-speed serial requirements. Its industrial temperature rating and RoHS compliance make it suitable for performance-driven applications that require reliability and regulatory conformity.

Choose this device when your design demands integrated processing blocks, multi-megabit on-chip RAM, large I/O counts, and platform-level transceiver and I/O capability—helping reduce external components and simplify system architecture while maintaining a compact board footprint.

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