XC2VP40-5FF1148C

IC FPGA 804 I/O 1148FCBGA
Part Description

Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 804 3538944 43632 1148-BBGA, FCBGA

Quantity 801 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1148-FCPBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1148-BBGA, FCBGANumber of I/O804Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs4848Number of Logic Elements/Cells43632
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3538944

Overview of XC2VP40-5FF1148C – Virtex®-II Pro FPGA, 1148-BBGA

The XC2VP40-5FF1148C is a Virtex®-II Pro field programmable gate array supplied by AMD, offered in a 1148-ball flip-chip BGA (FCBGA) package with a 35 × 35 mm footprint. It combines a large programmable fabric with on-chip memory and extensive I/O for system-level integration in commercial embedded and communications applications.

Built on the Virtex-II Pro platform, the device targets applications that require substantial logic density, significant embedded RAM, and a high I/O count, while providing platform features such as embedded processor blocks and RocketIO/RocketIO X transceiver support described for the family.

Key Features

  • Logic Capacity — 4,848 configurable logic blocks (CLBs) and 43,632 logic elements/cells to implement complex digital functions and control logic.
  • Embedded Memory — Approximately 3.54 Mbits of on-chip RAM (3,538,944 bits) for buffering, FIFOs, and memory-mapped designs.
  • I/O Density — 804 user I/O pins enabling wide parallel interfaces, multi-channel connectivity, and flexible board-level partitioning.
  • Package — 1148-BBGA (1148-FCPBGA) flip-chip BGA, 35 × 35 mm, surface-mount package suitable for compact system implementations.
  • Power Supply — Core supply range specified at 1.425 V to 1.575 V for predictable power planning and regulator selection.
  • Operating Range — Commercial temperature grade: 0 °C to 85 °C for standard commercial deployments.
  • Platform Features — Virtex-II Pro family capabilities documented in the datasheet include RocketIO/RocketIO X multi-gigabit transceivers, up to two embedded PowerPC processor blocks, dedicated 18×18 multipliers, digital clock manager (DCM), and SelectRAM™ memory hierarchy.
  • Regulatory — RoHS-compliant offering for lead-free assembly requirements.

Typical Applications

  • Telecommunications & Datacom — Use the device’s platform transceiver and high I/O count for protocol processing, framing, and multi-channel I/O aggregation.
  • Embedded Processing Systems — Leverage the Virtex-II Pro platform’s embedded processor block options and abundant logic to implement control planes and offload tasks from host processors.
  • High-Performance Prototyping — Large logic and memory capacity make this FPGA suitable for hardware emulation and design validation of complex digital subsystems.
  • Signal Processing and DSP — Dedicated multiplier blocks and plentiful embedded RAM support filtering, transforms, and streaming data paths.

Unique Advantages

  • High Logic Density: 43,632 logic elements provide substantial capacity for complex state machines, datapaths, and custom accelerators.
  • Extensive I/O: 804 I/O pins enable direct interfacing to multiple peripherals, wide buses, and high-channel-count systems without excessive external serialization.
  • On-Chip Memory: Approximately 3.54 Mbits of embedded RAM reduces external memory dependence for many buffering and storage needs.
  • Platform-Level Integration: Virtex-II Pro platform features—such as embedded processor blocks and RocketIO transceivers—allow system architects to integrate processing and serial connectivity directly in the FPGA fabric.
  • Industry-Standard Package: 1148-ball FCPBGA (35 × 35 mm) supports surface-mount assembly and compact board layout strategies.
  • RoHS Compliance: Conforms to lead-free manufacturing requirements for modern electronics production workflows.

Why Choose XC2VP40-5FF1148C?

The XC2VP40-5FF1148C positions itself as a high-capacity Virtex-II Pro FPGA option for commercial designs that need a balance of large logic resources, significant embedded memory, and high I/O density in a standard flip-chip BGA package. Its documented platform features support integration of embedded processing and multi-gigabit serial interfaces, enabling consolidated system architectures.

This device is suited to engineers and procurement teams building communications equipment, embedded compute modules, and high-density prototyping platforms who require precise electrical and thermal planning—core voltage range and operating temperature are explicitly specified to support predictable system design.

Request a quote or submit an inquiry to obtain pricing, availability, and technical support for the XC2VP40-5FF1148C.

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