XC2VP4-6FG456I

The XC2VP4-6FG456I is a Virtex®-II Pro field programmable gate array (FPGA) IC from AMD, delivered in a 456-ball BGA package. It is built on the Virtex‑II Pro platform FPGA architecture and targets applications that require a combination of on-chip logic, embedded memory, and extensive I/O.

As a member of the Virtex‑II Pro family, the device benefits from platform-level features described in the product series documentation, including embedded processor block capability and multi‑gigabit transceiver support. The part’s industrial-grade rating, comprehensive I/O count, and on-chip resources make it suitable for demanding embedded and communications applications.

Key Features

• Core logic — 752 CLBs providing approximately 6,768 logic elements for implementing custom digital logic and control functions.
• Embedded memory — Approximately 0.52 Mbits of on-chip RAM (516,096 bits) for buffering, FIFOs, and local storage.
• I/O density — 248 user I/O pins to support broad interfacing and system connectivity requirements.
• Platform capabilities — Built on the Virtex‑II Pro platform; family documentation cites support for RocketIO multi‑gigabit transceivers and up to two IBM PowerPC RISC processor blocks as platform-level features.
• DSP resources — Family-level architecture includes dedicated 18×18 multipliers and SelectRAM memory hierarchy for arithmetic and signal processing tasks.
• Package and mounting — 456‑BBGA supply/package (supplier device package listed as 456‑FBGA, 23×23); surface-mount device for board-level integration.
• Power and temperature — Core supply range 1.425 V to 1.575 V; industrial operating temperature range −40 °C to 100 °C.
• Compliance — RoHS compliant and specified as industrial grade.

Typical Applications

• Telecom and datacom infrastructure — Leverages Virtex‑II Pro platform transceiver features and reported telecom/datacom support modes for serial link and protocol implementations.
• Embedded processing and control — Family-level availability of PowerPC processor blocks enables system-on-chip style architectures for control, monitoring, or protocol processing.
• Signal processing and DSP — On-chip RAM and dedicated 18×18 multipliers support implementation of filtering, mixing, and other numeric-heavy functions.
• High-density I/O and interface bridging — 248 I/Os and flexible FPGA fabric make the device suitable for complex interface aggregation and protocol conversion tasks.

Unique Advantages

• Highly integrated platform — Platform-level features such as embedded processor support and multi‑gigabit transceiver capability reduce the need for additional components in system designs.
• Balanced logic and memory — Combination of 752 CLBs and approximately 0.52 Mbits of embedded RAM supports medium-complexity logic and buffering requirements on a single device.
• High I/O capacity — 248 I/Os provide flexibility for multi-channel systems, sensor arrays, and complex peripheral interfacing.
• Industrial-rated operation — Specified operating range from −40 °C to 100 °C and RoHS compliance support deployment in industrial environments.
• Proven architecture — Based on Virtex‑II Pro platform technologies (SelectRAM+, dedicated multipliers, digital clock management), delivering a familiar development model for FPGA designers.

Why Choose XC2VP4-6FG456I?

The XC2VP4-6FG456I combines a substantial logic fabric, embedded RAM, and a high I/O count in a 456‑ball BGA package, making it a practical choice for embedded systems, telecom/datacom modules, and signal-processing applications that require industrial-temperature operation. Its placement on the Virtex‑II Pro platform provides access to platform-level capabilities documented for the family, enabling integration of processor blocks and high-speed serial interfaces where applicable.

This device suits design teams seeking a robust FPGA with balanced on-chip resources and a familiar platform architecture, offering long-term value through scalable logic, memory resources, and industrial-grade operating conditions.

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