XC2VP4-6FG456C

The XC2VP4-6FG456C is a Virtex®-II Pro platform FPGA supplied by AMD in a 456-ball BGA package. It provides a programmable logic fabric with 6,768 logic elements and on-chip embedded memory for mid-range FPGA applications.

Designed for commercial-grade designs, this surface-mount device offers a broad set of platform capabilities—including embedded memory, plentiful I/O and support for Virtex-II Pro family features—making it suitable for communications, embedded processing and system integration tasks where flexible logic and moderate embedded memory are required.

Key Features

• Logic Capacity  6,768 logic elements to implement custom digital logic and control functions.
• Embedded Memory  Approximately 0.516 Mbits of on-chip RAM (516,096 total RAM bits) for FIFOs, buffering and local storage.
• I/O Density  248 user I/O pins to support a wide range of parallel interfaces and system connections.
• Package and Mounting  456-ball BGA package (supplier device package: 456-FBGA, 23×23) with surface-mount mounting for compact board-level integration.
• Power  Operates from a core supply range of 1.425 V to 1.575 V, enabling consistent power planning for the core domain.
• Commercial Operating Range  Rated for 0 °C to 85 °C operation (commercial grade) for standard environment deployments.
• RoHS Compliant  Environmental compliance suitable for lead-free assembly processes.
• Virtex-II Pro Platform Capabilities  Built on the Virtex-II Pro family architecture, which includes documented platform features such as embedded processor block support, multi-gigabit transceiver options and dedicated DSP/multiplier resources (family-level capabilities referenced in platform documentation).

Typical Applications

• Telecom/Datacom Systems  Use the device where programmable logic and on-chip memory are needed for protocol processing, buffering and interface bridging.
• Embedded Processing  Integrate custom accelerators or control logic alongside embedded processor resources available in the Virtex-II Pro platform.
• High-Density I/O Interfaces  Implement boards that require numerous parallel I/Os for sensors, peripherals or expansion interfaces using the 248 available I/O pins.

Unique Advantages

• Mid-Range Logic and Memory Balance: 6,768 logic elements coupled with approximately 0.516 Mbits of embedded RAM provide a balanced resource set for control, buffering and mid-complexity datapaths.
• High I/O Count in a Compact Package: 248 I/Os in a 456-BBGA (23×23) package minimizes board area while supporting multiple interfaces.
• Commercial Temperature Rating: Rated 0 °C to 85 °C to match standard commercial deployments and typical electronics environments.
• predictable Power Envelope: Defined core supply range (1.425 V–1.575 V) simplifies power-supply design for the core domain.
• Environmentally Compliant: RoHS compliance supports lead-free manufacturing and regulatory requirements for many markets.
• Platform Documentation: Backed by Virtex-II Pro family documentation that describes platform-level features and integration options for system architects.

Why Choose XC2VP4-6FG456C?

The XC2VP4-6FG456C delivers a practical combination of programmable logic, embedded memory and I/O density in a compact 456-BBGA surface-mount package. Its resource mix is well suited to designers who need a reliable, commercially rated FPGA for communications, embedded processing, or interface-dense applications where mid-range logic capacity and on-chip RAM are required.

Supported by Virtex-II Pro platform documentation from the manufacturer, this part offers predictable electrical characteristics, documented platform capabilities and RoHS compliance—helping teams accelerate integration while maintaining clear power and thermal targets for commercial deployments.

Request a quote or submit an inquiry to obtain pricing and availability for XC2VP4-6FG456C for your next design.