XC2VP40-5FG676C

The XC2VP40-5FG676C is a Virtex®-II Pro field programmable gate array (FPGA) IC supplied in a 676-ball fine-pitch BGA package. It provides a high-density reconfigurable logic platform with substantial on-chip memory, a high I/O count and proven platform features for designs that require flexible logic resources and system-level integration.

Key raw capabilities include 4,848 configurable logic blocks (CLBs) delivering 43,632 logic elements, approximately 3.54 Mbits of embedded memory, and 416 user I/Os. The device is a surface-mount component in a 676-FBGA (27×27) package, operates from a 1.425–1.575 V core supply and is specified for commercial temperature operation (0 °C to 85 °C).

Key Features

• Logic Capacity  4,848 CLBs providing 43,632 logic elements suitable for complex glue logic, protocol implemention and custom datapaths.
• Embedded Memory  Approximately 3.54 Mbits of on-chip RAM to support buffering, lookup tables and state storage without external memory.
• I/O Density  416 user I/Os to support wide parallel interfaces, bus connections and mixed-signal front-end routing.
• Power and Supply  Core voltage range 1.425 V to 1.575 V for integration into regulated power architectures.
• Package and Mounting  676-ball Fine-Pitch BGA (676-FBGA, 27×27) in a surface-mount form factor for compact, high-density board designs.
• Operating Range & Compliance  Commercial grade operation from 0 °C to 85 °C and RoHS-compliant construction.
• Platform-Level Capabilities  Virtex-II Pro family features include embedded processor block support and multi-gigabit transceiver architecture (family-level information from the Virtex-II Pro platform specification).

Typical Applications

• Communications & Networking  High I/O count and platform transceiver features make the device suitable for protocol bridging, packet processing and interface aggregation in telecom and datacom systems.
• Embedded Processing  On-chip memory and family-level processor block support enable offload of control and real-time tasks within embedded systems.
• Prototyping & System Integration  Dense logic and large I/O resources support rapid hardware validation and integration of complex digital subsystems.
• Signal Processing Acceleration  Dedicated multiplier resources and abundant local RAM make the FPGA appropriate for fixed-function DSP blocks and pipeline acceleration.

Unique Advantages

• High-density logic in a single device: 43,632 logic elements provide significant integration of custom logic without multiple chips.
• Substantial on-chip memory: approximately 3.54 Mbits of embedded RAM reduces external memory dependence and lowers BOM complexity.
• Large I/O footprint: 416 I/Os enable broad interfacing options for parallel buses, connectors and mixed I/O applications.
• Compact package option: 676-FBGA (27×27) provides a small PCB footprint while maintaining high pin count for dense system layouts.
• Commercial-grade qualification: Specified for 0 °C to 85 °C operation and RoHS compliance for mainstream electronics projects.

Why Choose XC2VP40-5FG676C?

The XC2VP40-5FG676C positions itself as a high-capacity Virtex®-II Pro platform FPGA with a blend of logic density, embedded memory and extensive I/O suitable for system designers who need a reconfigurable, integrated solution. Its combination of CLBs, large embedded RAM and high I/O count supports consolidation of multiple functions onto a single device, reducing board complexity and part count.

This device is well suited to engineering teams developing communications equipment, embedded processing platforms, and hardware-accelerated functions where reliable commercial-grade operation and RoHS compliance are required. The Virtex-II Pro family-level architecture provides a foundation of capabilities that can be applied across a range of design requirements.

Request a quote or submit an inquiry for pricing and availability of XC2VP40-5FG676C to get lead-time and order information tailored to your project needs.