XC2VP40-5FGG676I

The XC2VP40-5FGG676I is a Virtex®-II Pro family Field Programmable Gate Array provided in a 676-ball BGA package. It combines a high-capacity programmable logic fabric with family-level capabilities such as embedded processor blocks and multi-gigabit transceiver support for system designs that require processor integration, high I/O density, and substantial on-chip memory.

Targeted at industrial applications, this device offers a balance of logic density, embedded memory, and I/O resources, with operating voltage and temperature ranges suitable for demanding embedded systems.

Key Features

• Logic Capacity — Contains approximately 43,632 logic elements and 4,848 CLBs, providing significant combinational and sequential resources for complex digital designs.
• Embedded Memory — Approximately 3.5 Mbits of on-chip RAM (3,538,944 bits) for user buffers, FIFOs, and intermediate data storage.
• I/O Density — Up to 416 user I/O pins to support wide parallel interfaces and mixed-signal board topologies.
• Package & Mounting — 676-ball FBGA (27 × 27) surface-mount package (676-BGA/676-FBGA) for high-density PCB layouts.
• Power Supply — Core voltage range of 1.425 V to 1.575 V to match board power-rail requirements.
• Temperature & Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C for reliable field operation.
• Family-Level Capabilities — Virtex-II Pro family features include support for embedded PowerPC™ processor blocks, RocketIO™ multi-gigabit transceivers, dedicated 18-bit × 18-bit multiplier blocks, Digitally Controlled Impedance (DCI) I/O, and advanced clock management (as described in the family data).
• Compliance — RoHS compliant for environmental and manufacturing considerations.

Typical Applications

• Embedded Processing Platforms — Integrate on-chip processor blocks alongside programmable logic to implement real-time control, protocol handling, and system management.
• High-Density Interface Bridging — Leverage 416 I/O pins and the large logic fabric to bridge multiple parallel buses, implement protocol converters, or aggregate sensor/data interfaces.
• DSP and Signal Processing — Use the device’s embedded RAM and multiplier resources to implement filtering, aggregation, and intermediate processing in industrial signal chains.
• Communications Modules — Family support for RocketIO transceivers and advanced I/O features enables use in multi-gigabit and high-speed serial interfaces within communications equipment.

Unique Advantages

• High integration density: Approximately 43,632 logic elements and 4,848 CLBs reduce the need for external glue logic and simplify multi-function designs.
• Substantial on-chip memory: Around 3.5 Mbits of embedded RAM supports deep buffering and local storage without external memories.
• Robust I/O capability: 416 user I/Os in a 676-ball FBGA package enable extensive connectivity while preserving PCB area.
• Industrial temperature range: Rated −40 °C to 100 °C for deployment in industrial environments requiring extended temperature operation.
• Power-rail compatibility: Core voltage support from 1.425 V to 1.575 V aligns with common FPGA supply domains for system power planning.
• Standards-aware family features: Virtex-II Pro family-level elements such as embedded processor blocks, RocketIO transceivers, dedicated multipliers, and clock management circuitry provide a comprehensive platform for integrated system designs.

Why Choose XC2VP40-5FGG676I?

The XC2VP40-5FGG676I positions itself as a capable Virtex-II Pro family FPGA option for engineers needing substantial logic density, embedded memory, and a high count of I/O in a 676-BGA footprint. Its industrial temperature rating and RoHS compliance make it appropriate for production-grade embedded systems where reliable operation across temperature and environmental constraints is required.

This device is well suited to designers integrating on-chip processors, multi-gigabit interfaces, and significant DSP/memory workloads who require a single, scalable FPGA platform to consolidate functions and reduce external component count.

If you would like pricing, availability, or to request a formal quote for the XC2VP40-5FGG676I, submit an inquiry or request a quote through your preferred procurement channel and include the part number and required quantity.