XC2VP40-6FF1152I

IC FPGA 692 I/O 1152FCBGA
Part Description

Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 692 3538944 43632 1152-BBGA, FCBGA

Quantity 659 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O692Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs4848Number of Logic Elements/Cells43632
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3538944

Overview of XC2VP40-6FF1152I – Virtex®-II Pro FPGA, 1152-FCBGA (Industrial)

The XC2VP40-6FF1152I is a Virtex®-II Pro family FPGA offered in a 1152-FCBGA (35×35) surface-mount package and specified for industrial operation. It combines a high count of programmable logic elements with extensive on-chip RAM and large I/O capability to address designs requiring integrated logic, memory, and high-density connectivity.

Built on the Virtex-II Pro architecture, the device targets system-level integration tasks such as embedded processing, high-speed communications, and complex control functions where a mix of logic capacity, on-chip memory and versatile I/O are required.

Key Features

  • Programmable Logic  43,632 logic elements provide substantial capacity for complex logic implementation and system integration.
  • Embedded Memory  Approximately 3.5 Mbits of on-chip RAM (3,538,944 bits) for buffering, state storage, and local data handling.
  • I/O Density  Up to 692 user I/O pins support wide parallel interfaces and high pin-count system connectivity.
  • Virtex-II Pro Architecture  Architecture-level features include support for embedded PowerPC processor blocks and RocketIO multi-gigabit transceivers as described for the Virtex-II Pro family.
  • High-Speed Serial & Processing Support  Family-level options include RocketIO/RocketIO X multi-gigabit transceivers and up to two PowerPC™ 405 processor blocks for integrated serial links and embedded processing (family capability documented in the product specification).
  • DSP & Arithmetic Primitives  Dedicated 18-bit × 18-bit multiplier resources and SelectRAM memory hierarchy (documented at the family level) accelerate arithmetic and DSP workloads.
  • Clocking & Timing  On-chip clock management features such as Digital Clock Manager (DCM) are included in the Virtex-II Pro platform for flexible clock synthesis and distribution (family-level feature).
  • Package & Mounting  1152-FCBGA (35×35) package, surface-mount mounting for high-density PCB designs.
  • Power & Environmental  Core supply voltage range 1.425 V to 1.575 V and industrial operating temperature range −40 °C to 100 °C. RoHS compliant.

Typical Applications

  • Telecommunications & Datacom  Use where multi-gigabit serial links and protocol processing are required; the Virtex-II Pro family documentation describes RocketIO transceivers and telecom/datacom support modes.
  • Embedded Processing & Control  Designs that benefit from on-chip processor blocks and programmable logic for offload and tight hardware/software integration.
  • High-Density Interface Bridging  Systems requiring many parallel I/Os and local memory—ideal for protocol bridging, I/O expansion, and complex peripheral interfaces.
  • Industrial Automation & Instrumentation  Industrial-grade temperature range and robust I/O count suit control, data acquisition, and processing tasks in harsh environments.

Unique Advantages

  • High integration density: Consolidate logic, memory, and I/O in a single device to reduce board-level components and simplify system design.
  • On-chip memory capacity: Approximately 3.5 Mbits of embedded RAM lowers external memory requirements and improves data locality and throughput.
  • Extensive I/O and package density: 692 I/O pins in a 1152-FCBGA package enable compact, high-pin-count designs without sacrificing routing flexibility.
  • Industrial reliability window: Specified operation from −40 °C to 100 °C supports deployment in industrial environments.
  • Platform-level feature set: Virtex-II Pro architecture-level capabilities (PowerPC support, RocketIO transceivers, DCM, DSP primitives) provide a foundation for mixed-signal, compute and high-speed interface designs.
  • Regulatory compliance: RoHS compliant for environmental and manufacturing consistency.

Why Choose XC2VP40-6FF1152I?

The XC2VP40-6FF1152I brings together a large logic fabric, substantial embedded memory, and very high I/O density in a single industrial-grade FCBGA package. It is suited to engineers who need a programmable platform that supports embedded processing, high-speed serial interfaces, and dense parallel connectivity while operating across a wide temperature range.

For projects that demand system consolidation, predictable operating ranges, and a platform-level feature set (including DSP primitives, clock management and documented support for embedded processor and transceiver capabilities), this Virtex-II Pro device offers a balanced combination of resources and packaging for medium- to high-complexity designs.

Request a quote or submit an inquiry today to check pricing and availability for the XC2VP40-6FF1152I and to discuss how its on-chip resources and package options fit your next design.

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