XC2VP40-6FF1152I
| Part Description |
Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 692 3538944 43632 1152-BBGA, FCBGA |
|---|---|
| Quantity | 659 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 692 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 4848 | Number of Logic Elements/Cells | 43632 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3538944 |
Overview of XC2VP40-6FF1152I – Virtex®-II Pro FPGA, 1152-FCBGA (Industrial)
The XC2VP40-6FF1152I is a Virtex®-II Pro family FPGA offered in a 1152-FCBGA (35×35) surface-mount package and specified for industrial operation. It combines a high count of programmable logic elements with extensive on-chip RAM and large I/O capability to address designs requiring integrated logic, memory, and high-density connectivity.
Built on the Virtex-II Pro architecture, the device targets system-level integration tasks such as embedded processing, high-speed communications, and complex control functions where a mix of logic capacity, on-chip memory and versatile I/O are required.
Key Features
- Programmable Logic 43,632 logic elements provide substantial capacity for complex logic implementation and system integration.
- Embedded Memory Approximately 3.5 Mbits of on-chip RAM (3,538,944 bits) for buffering, state storage, and local data handling.
- I/O Density Up to 692 user I/O pins support wide parallel interfaces and high pin-count system connectivity.
- Virtex-II Pro Architecture Architecture-level features include support for embedded PowerPC processor blocks and RocketIO multi-gigabit transceivers as described for the Virtex-II Pro family.
- High-Speed Serial & Processing Support Family-level options include RocketIO/RocketIO X multi-gigabit transceivers and up to two PowerPC™ 405 processor blocks for integrated serial links and embedded processing (family capability documented in the product specification).
- DSP & Arithmetic Primitives Dedicated 18-bit × 18-bit multiplier resources and SelectRAM memory hierarchy (documented at the family level) accelerate arithmetic and DSP workloads.
- Clocking & Timing On-chip clock management features such as Digital Clock Manager (DCM) are included in the Virtex-II Pro platform for flexible clock synthesis and distribution (family-level feature).
- Package & Mounting 1152-FCBGA (35×35) package, surface-mount mounting for high-density PCB designs.
- Power & Environmental Core supply voltage range 1.425 V to 1.575 V and industrial operating temperature range −40 °C to 100 °C. RoHS compliant.
Typical Applications
- Telecommunications & Datacom Use where multi-gigabit serial links and protocol processing are required; the Virtex-II Pro family documentation describes RocketIO transceivers and telecom/datacom support modes.
- Embedded Processing & Control Designs that benefit from on-chip processor blocks and programmable logic for offload and tight hardware/software integration.
- High-Density Interface Bridging Systems requiring many parallel I/Os and local memory—ideal for protocol bridging, I/O expansion, and complex peripheral interfaces.
- Industrial Automation & Instrumentation Industrial-grade temperature range and robust I/O count suit control, data acquisition, and processing tasks in harsh environments.
Unique Advantages
- High integration density: Consolidate logic, memory, and I/O in a single device to reduce board-level components and simplify system design.
- On-chip memory capacity: Approximately 3.5 Mbits of embedded RAM lowers external memory requirements and improves data locality and throughput.
- Extensive I/O and package density: 692 I/O pins in a 1152-FCBGA package enable compact, high-pin-count designs without sacrificing routing flexibility.
- Industrial reliability window: Specified operation from −40 °C to 100 °C supports deployment in industrial environments.
- Platform-level feature set: Virtex-II Pro architecture-level capabilities (PowerPC support, RocketIO transceivers, DCM, DSP primitives) provide a foundation for mixed-signal, compute and high-speed interface designs.
- Regulatory compliance: RoHS compliant for environmental and manufacturing consistency.
Why Choose XC2VP40-6FF1152I?
The XC2VP40-6FF1152I brings together a large logic fabric, substantial embedded memory, and very high I/O density in a single industrial-grade FCBGA package. It is suited to engineers who need a programmable platform that supports embedded processing, high-speed serial interfaces, and dense parallel connectivity while operating across a wide temperature range.
For projects that demand system consolidation, predictable operating ranges, and a platform-level feature set (including DSP primitives, clock management and documented support for embedded processor and transceiver capabilities), this Virtex-II Pro device offers a balanced combination of resources and packaging for medium- to high-complexity designs.
Request a quote or submit an inquiry today to check pricing and availability for the XC2VP40-6FF1152I and to discuss how its on-chip resources and package options fit your next design.

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