XC2VP40-6FFG1152C

The XC2VP40-6FFG1152C is a commercial-grade Virtex®-II Pro platform FPGA manufactured by AMD. It delivers high logic density and on-chip memory in a 1152-ball flip-chip BGA package for surface-mount integration.

Designed for applications that require large interfacing capacity and sizeable embedded resources, this device is built on the Virtex-II Pro FPGA architecture and targets complex logic, memory-intensive, and high-pin-count designs while operating within a 0 °C to 85 °C commercial temperature range.

Key Features

• Logic capacity — 43,632 logic elements to support complex, high-density logic implementations.
• Embedded memory — Approximately 3.54 Mbits of on-chip RAM for frame buffers, FIFOs, and local storage.
• I/O availability — 692 I/O pins to accommodate wide bus interfaces and multiple peripheral connections.
• Package — 1152-FCBGA (35×35) package case in a surface-mount form factor for compact, high-pin-count board designs.
• Power — Nominal core supply range 1.425 V to 1.575 V to match system power rails and regulator designs.
• Temperature and grade — Commercial grade operation from 0 °C to 85 °C for mainstream embedded and communications equipment.
• Standards compliance — RoHS compliant for environmental and regulatory compatibility.
• Platform capabilities — Built on the Virtex-II Pro FPGA platform, which includes architecture-level features such as selectable on-chip memory hierarchies, dedicated multiplier blocks, clock management circuitry, and processor/transceiver support at the family level.

Typical Applications

• High-density embedded systems — Large logic and embedded RAM enable implementation of custom processing, signal handling, and control functions within compact systems.
• High-pin-count interface controllers — 692 I/O pins and a 1152-FCBGA package support complex multi-channel interfaces and board-level integration.
• Communications and networking equipment — Platform-level support for advanced transceivers and high logic density suits packet processing, protocol bridging, and data path functions in commercial networking gear.

Unique Advantages

• Substantial logic resources: 43,632 logic elements provide headroom for large-scale logic designs and mixed-function implementations.
• Significant on-chip memory: Approximately 3.54 Mbits of RAM reduces external memory dependency and simplifies latency-sensitive designs.
• Extensive I/O: 692 I/O pins enable broad peripheral connectivity and high-bandwidth board interfaces without multiple interface chips.
• Compact, high-density packaging: The 1152-FCBGA (35×35) package concentrates pins and routing density for space-constrained PCBs.
• Commercial-ready qualification: Operates across a 0 °C to 85 °C range and is RoHS compliant for mainstream electronics manufacturing.
• Platform-level ecosystem: Based on the Virtex-II Pro FPGA platform, offering architectural building blocks such as dedicated multipliers and clock management to accelerate design implementation.

Why Choose XC2VP40-6FFG1152C?

The XC2VP40-6FFG1152C positions itself as a high-density, commercially graded FPGA option for designs that demand substantial logic, on-chip memory, and a large number of I/Os in a compact FCBGA footprint. Its power supply and thermal range align with standard commercial system designs, and RoHS compliance supports regulated manufacturing environments.

Engineers selecting this device benefit from the Virtex-II Pro platform architecture and the combination of logic capacity, embedded RAM, and I/O density—making it suitable for complex embedded applications, communication front-ends, and high-pin-count interface controllers where architectural flexibility and integration matter.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the XC2VP40-6FFG1152C.