XC2VP40-6FGG676C

The XC2VP40-6FGG676C is a Virtex®-II Pro platform FPGA in a 676-ball BGA package, designed for mid-to-high-density programmable logic applications. This surface-mount, commercial-grade device provides substantial on-chip resources—including 43,632 logic elements and approximately 3.5 Mbits of embedded memory—paired with a 416-pin I/O count for high-integration system designs.

Supplied by AMD and aligned with the Virtex-II Pro platform specification, the device supports the platform-level feature set described in the family datasheet, making it suitable for applications that require a combination of programmable logic, embedded memory, and extensive I/O connectivity within a standard FBGA footprint.

Key Features

• Logic Capacity  43,632 logic elements provide the programmable fabric needed for complex combinational and sequential logic functions.
• Embedded Memory  Approximately 3.5 Mbits of on-chip RAM (3,538,944 total RAM bits) for buffering, FIFOs, and local storage.
• I/O Density  416 user I/O pins support extensive interfacing to peripherals, front-end modules, and board-level signaling.
• Platform Features (family)  Virtex-II Pro platform-level features documented in the datasheet include multi-gigabit transceiver support and embedded processor block options for designs referencing family capabilities.
• Package  676-ball BGA (supplier package: 676-FBGA, 27 × 27 mm) optimized for board-level integration and high-density routing.
• Power Supply  Core supply voltage range 1.425 V to 1.575 V, enabling controlled power delivery and board power budgeting.
• Mounting & Grade  Surface-mount package with commercial operating grade and a specified operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant for lead-free compliance in manufacturing processes.

Typical Applications

• High-speed communications  Use the Virtex-II Pro platform features to implement protocol processing and I/O aggregation where dense logic and high I/O counts are required.
• Embedded processing  Leverage family-level embedded processor block support (as documented in the Virtex-II Pro datasheet) in designs that combine programmable logic with on-chip processor resources.
• Data buffering and packet processing  The combination of ~3.5 Mbits of embedded memory and abundant logic elements suits packet buffering, table lookups, and stream processing tasks.
• Board-level prototyping and system integration  416 I/Os and a standardized 676-FBGA package facilitate integration into complex system boards and prototyping platforms.

Unique Advantages

• High logic density: 43,632 logic elements enable implementation of complex logic, state machines, and custom accelerators without immediate external logic expansion.
• Substantial on-chip memory: Approximately 3.5 Mbits of embedded RAM reduce dependency on external memory for mid-sized buffering and temporary storage tasks.
• Extensive I/O connectivity: 416 I/O pins provide flexibility for interfacing to multiple peripherals, buses, and board-level interfaces.
• Standard FBGA package: The 676-FBGA (27 × 27 mm) package supports high-density board designs and established assembly flows.
• Industry-compliant supply range: Core voltage specified between 1.425 V and 1.575 V enables predictable power design and regulation choices on the board.
• RoHS compliant: Facilitates lead‑free manufacturing and environmental compliance.

Why Choose XC2VP40-6FGG676C?

The XC2VP40-6FGG676C provides a balanced combination of logic capacity, embedded memory, and high I/O density in a commercial-grade, surface-mount FBGA package. It is positioned for designs that require significant programmable resources and extensive board-level interfacing while maintaining predictable power and thermal conditions defined by the device’s commercial operating range.

This device suits engineering teams building mid-to-high complexity systems that benefit from the Virtex-II Pro family architecture and documented platform capabilities. The combination of on-chip memory, large logic fabric, and comprehensive I/O support makes it a practical choice for communication, embedded processing, and system integration projects where these specific device attributes match the design requirements.

If you would like pricing, availability, or a custom quote for XC2VP40-6FGG676C, submit a request to receive a formal quote or product inquiry and our team will respond promptly.