XC2VP40-7FFG1152C

The XC2VP40-7FFG1152C is a Virtex®-II Pro series FPGA in a 1152-ball flip-chip BGA (1152-FCBGA, 35×35) package, designed for commercial embedded and high-density programmable logic applications. It combines a large logic resource count, substantial on-chip memory, and a high I/O count to support complex custom logic, embedded processing, and multi-interface designs.

Key Features

• High Logic Density — 43,632 logic elements provide extensive programmable fabric for complex combinational and sequential logic implementations.
• Embedded Memory — Approximately 3.54 Mbits of on-chip RAM for local data buffering, state storage, and embedded system memory requirements.
• Large I/O Count — 692 I/O pins to support wide parallel buses, multiple peripheral interfaces, and high-pin-count system integration.
• Power and Supply — Core voltage supply specified at 1.425 V to 1.575 V for predictable power design and supply margining.
• Package & Mounting — 1152-FCBGA (35×35) flip-chip BGA package, surface-mount mount type, suitable for high-density PCB integration.
• Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant for environmental and regulatory alignment.
• Virtex-II Pro Family Capabilities — The Virtex-II Pro platform (family-level) includes features such as embedded PowerPC™ processor blocks, RocketIO™ multi-gigabit transceivers, dedicated 18×18 multipliers, digital clock management, and SelectRAM™ memory hierarchy (family-level characteristics from the product series specification).

Typical Applications

• Telecom & Datacom Systems — High I/O count and family-level multi-gigabit transceiver capabilities make this device suitable for communications line cards, protocol bridging, and packet processing tasks.
• Embedded Processing Platforms — Family support for embedded PowerPC RISC processor blocks supports systems requiring integrated processing and programmable logic in a single device.
• Custom Hardware Acceleration — High logic element count and on-chip RAM enable acceleration of compute-intensive functions and algorithm offload from host processors.
• Prototyping & System Integration — Large I/O and dense logic resources are well-suited for board-level prototyping, complex I/O routing, and integration of multiple digital subsystems.

Unique Advantages

• Extensive Programmable Fabric: 43,632 logic elements provide the capacity to implement large state machines, datapaths, and custom accelerators without external logic.
• Substantial On-Chip Memory: Approximately 3.54 Mbits of embedded RAM reduces reliance on external memory for buffering and local storage, simplifying board-level design.
• High I/O Integration: 692 I/Os enable direct interfacing to wide buses, numerous peripherals, and high-density connectors, minimizing external multiplexing.
• Commercial-Grade Reliability: Specified for 0 °C to 85 °C operation and RoHS compliance for consistent performance in commercial deployments.
• Platform-Level Integration: Virtex-II Pro family features (embedded processors, RocketIO transceivers, multipliers, clock management) offer a platform foundation for mixed processing and high-speed communication designs.

Why Choose XC2VP40-7FFG1152C?

The XC2VP40-7FFG1152C positions itself as a high-density, commercial-grade Virtex-II Pro FPGA option for designers needing substantial programmable logic, significant embedded memory, and a high I/O count in a 1152-ball flip-chip BGA package. Its power supply window and operating temperature range allow straightforward power-system design and deployment in typical commercial environments.

This device is appropriate for teams developing communications hardware, embedded processing platforms, and custom acceleration solutions who require a proven FPGA platform with family-level capabilities such as embedded processor support and multi-gigabit transceiver options.

Request a quote or submit an inquiry to receive pricing and availability information for the XC2VP40-7FFG1152C. Our team can provide lead-time details and help with sourcing for your design schedule.