XC2VP40-7FGG676C

IC FPGA 416 I/O 676FBGA
Part Description

Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 416 3538944 43632 676-BGA

Quantity 757 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case676-BGANumber of I/O416Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4848Number of Logic Elements/Cells43632
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3538944

Overview of XC2VP40-7FGG676C – Virtex®-II Pro FPGA, 676‑BGA, 416 I/O

The XC2VP40-7FGG676C is a Virtex®-II Pro family field programmable gate array (FPGA) in a 676-ball fine-pitch BGA package. It combines a high density of programmable logic, substantial on-chip memory, and broad I/O to support platform-level FPGA designs.

This device is suited for applications that require dense logic resources, multiple high-count I/O, and on-chip RAM for buffering and scratch storage. Its platform architecture includes family-level features such as embedded processor support and high-speed serial transceiver capabilities described in the Virtex-II Pro product documentation.

Key Features

  • Logic Capacity  43,632 logic elements for implementing complex custom logic and state machines.
  • Embedded Memory  Approximately 3.5 Mbits of on-chip RAM (3,538,944 bits) for data buffering, packet storage, and lookup tables.
  • I/O Density  416 user I/O pins to support wide parallel interfaces, multiple peripheral connections, and board-level routing flexibility.
  • Packaging  676‑FBGA (27 × 27 mm) surface-mount package, suitable for dense PCB implementations requiring BGA mounting.
  • Power  Device core supply range 1.425 V to 1.575 V to match common FPGA power architectures.
  • Operating Temperature  Commercial grade, 0 °C to 85 °C for standard commercial-environment deployments.
  • Platform Features (Virtex-II Pro)  Family-level features include embedded multi‑gigabit RocketIO transceivers, PowerPC™ processor block options, dedicated 18×18 multiplier blocks, digital clock management, SelectI/O™-Ultra, and digitally controlled impedance (DCI) I/O.
  • Compliance  RoHS compliant.

Typical Applications

  • High‑speed communications  Use the device’s platform transceiver and dense logic to implement protocol processing, packet handling, and high-throughput link interfacing.
  • Embedded processing platforms  Leverage the Virtex-II Pro family’s processor block options for compact SoC-style designs requiring on-chip CPU and programmable logic.
  • Digital signal processing  Dedicated multiplier blocks and abundant logic make the device suitable for DSP tasks such as filtering, transforms, and real-time data manipulation.
  • Network infrastructure  Large on-chip RAM and high I/O count support buffering and wide parallel interfaces used in switches, routers, and aggregation equipment.

Unique Advantages

  • High-density programmable logic: 43,632 logic elements provide the capacity to implement complex custom functions on a single device.
  • Substantial on-chip memory: Approximately 3.5 Mbits of embedded RAM reduces external memory dependence for many buffering and table lookup needs.
  • Extensive I/O: 416 user I/O pins enable broad peripheral connectivity and flexible board-level partitioning.
  • Platform-level feature set: Family capabilities such as RocketIO transceivers and processor block options enable integration of serial links and embedded processing.
  • Commercial temperature and surface-mount packaging: 676‑FBGA package and 0 °C to 85 °C rating support standard commercial product deployments.
  • Regulatory friendliness: RoHS compliance simplifies environmental qualification for many markets.

Why Choose XC2VP40-7FGG676C?

The XC2VP40-7FGG676C brings a balance of logic density, embedded memory, and I/O capability within the Virtex‑II Pro platform architecture. It is well suited for designers building platform-level FPGAs that require on-chip resources for buffering, signal processing, and complex control logic, with family-level options for embedded processors and high-speed serial interfaces.

Choose this device when you need a mature platform with documented architecture and the hardware resources to consolidate multiple functions onto a single FPGA, reducing board-level complexity and part count.

Please request a quote or submit an inquiry to check availability and begin a procurement conversation for the XC2VP40-7FGG676C.

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