XC2VP40-7FF1152C

The XC2VP40-7FF1152C is a Virtex®-II Pro field programmable gate array in a 1152-ball flip-chip BGA (35×35) package. It delivers high logic capacity, abundant I/O, and substantial on‑chip memory in a commercial‑grade FPGA targeted at complex embedded and system‑level applications.

This device is built for designs that require a combination of programmable logic, significant embedded memory, and high I/O density, supported by a nominal core supply range of 1.425 V to 1.575 V and an operating temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity  4,848 CLBs providing 43,632 logic elements to implement complex digital functions and control logic.
• Embedded Memory  Approximately 3.54 Mbits of on‑chip RAM to support buffering, lookup tables, and state storage without external memory for many functions.
• High I/O Density  692 user I/Os to interface with multiple peripherals, parallel buses, and high‑pin‑count systems.
• Package  1152‑FCBGA (35×35) flip‑chip BGA package for compact board integration and high signal density.
• Power  Core supply range specified at 1.425 V to 1.575 V to match standard FPGA power rails.
• Operating Range  Commercial grade operation from 0 °C to 85 °C for standard embedded and industrial‑office environments.
• Mounting & Compliance  Surface mount package; RoHS compliant for regulatory and manufacturing compatibility.
• Family Capabilities  The Virtex‑II Pro family supports embedded processor integration and high‑speed serial interfaces — including up to two IBM PowerPC RISC processor blocks and RocketIO multi‑gigabit transceivers (family feature set documented in the datasheet).

Typical Applications

• Embedded System Controllers  Use the device’s large logic capacity and embedded memory to implement system control, protocol handling, and custom hardware acceleration.
• Communications Equipment  High I/O count and family support for multi‑gigabit transceivers make the FPGA suitable for network interface glue logic and data path processing.
• Data Acquisition & Processing  On‑chip RAM and abundant logic elements enable real‑time data buffering, preprocessing, and signal conditioning tasks.
• Prototyping & Platform Development  The device’s package and feature set support board‑level system prototypes and platform FPGA roles in development environments.

Unique Advantages

• Substantial Logic Resources: 43,632 logic elements combined with 4,848 CLBs provide headroom for complex designs and multiple concurrent functions.
• Significant Embedded Memory: Approximately 3.54 Mbits of on‑chip RAM reduces dependence on external memory for many buffering and stateful operations.
• Very High I/O Count: 692 I/Os offer flexibility for interfacing with dense connectors, parallel buses, and multi‑channel peripherals.
• Compact High‑Density Package: The 1152‑FCBGA (35×35) format enables dense board integration while supporting high pin counts.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C operation to match a wide range of standard electronic applications.
• Standards‑Friendly Compliance: RoHS compliance simplifies regulatory and manufacturing processes for modern electronics production.

Why Choose XC2VP40-7FF1152C?

The XC2VP40-7FF1152C positions itself as a high‑capacity, high‑I/O Virtex‑II Pro FPGA tailored for system designers who need extensive programmable logic, embedded memory, and dense interfacing in a single package. Its combination of thousands of logic elements, multi‑megabit on‑chip RAM, and hundreds of I/Os supports complex control, data path, and prototyping tasks.

Designed for commercial applications, the device offers robust specifications for power and temperature and is RoHS compliant, making it suitable for a broad range of production and development projects that rely on scalable, programmable hardware building blocks.

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