XC2VP40-6FGG676I

The XC2VP40-6FGG676I is a Virtex®-II Pro series FPGA supplied in a 676-ball fine-pitch BGA package (676-FBGA, 27×27) and designed for surface-mount assembly. It provides a high-density programmable logic resource set with a substantial on-chip memory footprint and a large I/O count for industrial applications.

Typical use cases include communications infrastructure, embedded processing platforms and industrial control systems where a combination of logic density, embedded memory and a broad I/O complement are required. The device is offered with documented family-level features and IP/core reference support in the product datasheet.

Key Features

• Logic Density  Approximately 43,632 logic elements to implement complex custom logic and control functions.
• Embedded Memory  Approximately 3.54 Mbits of on-chip RAM for buffering, lookup tables and local storage.
• I/O and Package  Up to 416 user I/O pins provided in a 676-FBGA (27×27) package; surface mount package for compact board designs.
• Power Supply  Core voltage supply range of 1.425 V to 1.575 V to match system power rails.
• Industrial Operating Range  Rated for operation from −40 °C to 100 °C and listed as Industrial grade.
• Compliance  RoHS compliant.
• Virtex‑II Pro Family Features (per datasheet)  Family-level capabilities documented in the datasheet include support for embedded PowerPC processor blocks, RocketIO multi‑gigabit transceivers, 18×18 multipliers and Digital Clock Manager (DCM) resources.

Typical Applications

• Telecom & Datacom: Building protocol bridges and high-speed serial interfaces using the Virtex‑II Pro family transceiver and clocking resources documented in the datasheet.
• Embedded Processing Platforms: Systems that require integrated processor blocks and programmable logic for custom control, preprocessing or protocol handling.
• Industrial Control & Automation: Control systems and I/O-intensive automation equipment that benefit from the device’s 416 I/O pins and industrial temperature rating.
• High‑Density Logic Integration: Applications that consolidate multiple discrete functions into a single FPGA leveraging the device’s logic elements and embedded memory.

Unique Advantages

• High integration in a compact package: 416 I/Os and approximately 43,632 logic elements in a 676-FBGA enable dense implementations with a reduced board footprint.
• Substantial on-chip RAM: Approximately 3.54 Mbits of embedded memory reduces reliance on external RAM for many buffering and LUT needs.
• Industrial temperature capability: Rated for −40 °C to 100 °C, suitable for systems requiring extended operating ranges.
• Documented family-level resources: Datasheet coverage of embedded processors, transceivers, dedicated multipliers and clock management simplifies system-level planning and IP reuse.
• RoHS compliant: Meets lead-free manufacturing and environmental requirements.
• Controlled core voltage: Narrow supply range (1.425–1.575 V) for predictable power design and regulation.

Why Choose XC2VP40-6FGG676I?

The XC2VP40-6FGG676I positions itself as a high-density, industrial-grade Virtex‑II Pro family FPGA suitable for designs that require a balance of programmable logic, on-chip memory and a large I/O complement in a compact BGA package. Its documented family-level features and comprehensive datasheet support make it a fit for engineers developing communications, embedded processing and industrial control solutions.

For projects that need scalable logic resources, significant embedded RAM and broad I/O capability with industrial temperature support, the XC2VP40-6FGG676I provides a clear specification set to guide integration and system design.

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