XC2VP40-6FFG1152I
| Part Description |
Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 692 3538944 43632 1152-BBGA, FCBGA |
|---|---|
| Quantity | 1,581 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 692 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 4848 | Number of Logic Elements/Cells | 43632 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3538944 |
Overview of XC2VP40-6FFG1152I – Virtex®-II Pro FPGA, 1152‑FCBGA, Industrial Grade
The XC2VP40-6FFG1152I is a Virtex®-II Pro platform Field Programmable Gate Array supplied in a 1152‑FCBGA (35×35) package for surface-mount applications. It combines a high logic capacity with substantial embedded RAM and a large I/O count for designs that require dense, reconfigurable logic and broad external connectivity.
This device is targeted at system and board designers in markets that demand industrial temperature operation and reliable, RoHS‑compliant components, providing a balance of logic resources, embedded memory, and system-level features from the Virtex‑II Pro family.
Key Features
- Logic Capacity 43,632 logic elements suitable for complex digital designs and implementation of dense logic functions.
- Embedded Memory Approximately 3.54 Mbits of on‑chip RAM to support buffering, lookup tables and memory-intensive logic functions.
- I/O Count 692 user I/Os enabling extensive peripheral and board‑level connectivity without external multiplexing.
- Virtex‑II Pro Platform Features (series‑level) Includes architecture elements from the Virtex‑II Pro family such as support for RocketIO multi‑gigabit transceivers, embedded PowerPC™ 405 processor blocks, dedicated 18×18 multiplier blocks, and high‑performance clock management circuitry.
- Package & Mounting 1152‑FCBGA (35×35) package in a surface‑mount form factor for compact board designs and high pin density.
- Power Supply Specified core voltage range of 1.425 V to 1.575 V for predictable power design and supply sequencing.
- Operating Temperature Industrial temperature rating from −40 °C to 100 °C for deployment in harsh or temperature‑variable environments.
- RoHS Compliance Device is RoHS compliant to support environmentally constrained manufacturing requirements.
Typical Applications
- Telecom & Datacom Implements high‑speed interfaces and protocol processing where the Virtex‑II Pro platform’s multi‑gigabit transceiver support and dense logic are beneficial.
- Embedded Processing Supports designs that integrate processor subsystems (PowerPC cores at the family level) alongside FPGA logic for control, data aggregation, and custom acceleration.
- High‑Performance I/O Systems Large I/O count and on‑chip RAM make the device suitable for applications requiring extensive parallel connectivity and local buffering.
- Prototyping & Custom Accelerators Leverages substantial logic and memory resources to prototype complex algorithms or implement application‑specific hardware accelerators.
Unique Advantages
- High logic density: 43,632 logic elements provide the capacity to implement complex state machines, datapaths and control logic without excessive partitioning.
- Significant embedded memory: Approximately 3.54 Mbits of on‑chip RAM reduces dependence on external memory for many buffering and table storage needs.
- Extensive I/O connectivity: 692 I/Os enable direct interfacing to a wide array of peripherals and high‑pin‑count board designs.
- Industrial temperature range: Rated from −40 °C to 100 °C for reliable operation across demanding thermal environments.
- Compact, high‑density package: 1152‑FCBGA (35×35) provides high pin count in a compact footprint suited for space‑constrained boards.
- Platform feature set: Access to Virtex‑II Pro series capabilities such as dedicated multiplier blocks and clock management supports sophisticated signal processing and timing architectures.
Why Choose XC2VP40-6FFG1152I?
The XC2VP40-6FFG1152I positions itself as a versatile Virtex‑II Pro platform FPGA that brings together high logic capacity, substantial embedded memory, and a large I/O complement in an industrial‑rated, RoHS‑compliant package. Its package density and electrical specifications suit designers who need consolidated, reconfigurable logic and memory resources on compact PCBs.
This device is appropriate for engineers and teams building systems that require scalable logic resources, broad connectivity, and support for platform‑level features documented in the Virtex‑II Pro family. It provides a clear upgrade path within the platform for designs that may leverage family capabilities such as embedded processor blocks and multi‑gigabit transceivers.
Request a quote or submit a sales inquiry to receive pricing, lead‑time and availability details for the XC2VP40-6FFG1152I. Our team can provide technical and procurement support to help you evaluate this device for your next design.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








