XC2VP40-6FF1152C

The XC2VP40-6FF1152C is a Virtex®-II Pro platform field programmable gate array (FPGA) in a 1152‑ball flip‑chip BGA package, offered for commercial applications. It provides a high-density logic fabric with substantial embedded memory and a large I/O count to support complex digital designs and system integration.

Engineered for designs that require dense logic, plentiful on‑chip memory, and extensive connectivity, this device targets applications that benefit from integrated FPGA resources and platform-level features available across the Virtex‑II Pro family.

Key Features

• Logic Capacity  Approximately 43,632 logic cells (reported as 43,632 logic elements) arranged for flexible combinational and sequential logic implementations.
• Embedded Memory  Approximately 3.5 Mbits of on‑chip RAM (3,538,944 total RAM bits) for frame buffers, FIFOs, and data buffering.
• I/O Density  High pin count with 692 available I/O to support wide parallel interfaces and multiple peripheral connections.
• Virtex‑II Pro Platform Features  Platform-level capabilities described in the Virtex‑II Pro family documentation, including multi‑gigabit transceiver and embedded processor block options available across the family.
• DSP Resources  Dedicated multiplier resources are part of the Virtex‑II Pro architecture (18‑bit × 18‑bit multiplier blocks noted in family documentation) to accelerate arithmetic and signal processing functions.
• Package and Mounting  1152‑ball flip‑chip BGA (1152‑FCBGA, 35×35) in a surface‑mount form factor for high‑density board integration.
• Power Supply  Core supply range specified at 1.425 V to 1.575 V, enabling precise power budgeting and board power design.
• Operating Range & Compliance  Commercial operating temperature range of 0 °C to 85 °C and RoHS compliance for environmental compatibility.

Typical Applications

• Communication Systems  High I/O count and the Virtex‑II Pro family’s multi‑gigabit transceiver capability make this device suitable for board‑level communication interfaces and protocol bridging.
• Embedded Processing Platforms  Family support for embedded processor blocks enables integration of control and data‑path processing alongside FPGA logic for system‑level designs.
• Signal Processing & DSP  On‑chip RAM and dedicated multiplier resources support buffering and arithmetic operations common in DSP and real‑time data processing tasks.
• Prototyping & System Integration  The device’s logic density and rich I/O allow rapid implementation and validation of complex designs prior to final system deployment.

Unique Advantages

• High-density logic and memory: Combines tens of thousands of logic cells with approximately 3.5 Mbits of embedded RAM to implement gate‑array scale designs on a single device.
• Extensive I/O capacity: 692 I/O pins enable broad peripheral connectivity and wide parallel interfaces without external multiplexing.
• Platform-level integration: Built on the Virtex‑II Pro platform, with documented support for multi‑gigabit transceivers and embedded processor blocks across the family for integrated system designs.
• Compact, manufacturable package: 1152‑FCBGA (35×35) surface‑mount package offers a dense package footprint suitable for modern PCB layouts.
• Commercial temperature and RoHS compliant: Specified for 0 °C to 85 °C operation and RoHS compliant for regulatory alignment in commercial products.
• Well-documented platform: Comprehensive family documentation includes functional descriptions, electrical characteristics, and IP/core support referenced in the Virtex‑II Pro complete data sheet.

Why Choose XC2VP40-6FF1152C?

The XC2VP40-6FF1152C delivers a balanced combination of high logic capacity, substantial embedded memory, and a large I/O count in a compact 1152‑FCBGA package—making it a strong choice for commercial applications that require dense programmable logic and broad interface capability. Its placement on the Virtex‑II Pro platform provides access to family-level features and documentation that support system integration and IP reuse.

This device is suitable for design teams implementing high‑density digital processing, flexible interfacing, and embedded system functions where commercial temperature operation and RoHS compliance are required.

Request a quote or submit a purchase inquiry to obtain pricing and availability for the XC2VP40-6FF1152C.