XC2VP40-6FG676C

The XC2VP40-6FG676C is a Virtex-II Pro platform FPGA offered in a 676-ball BGA package designed for commercial applications. It combines a high-density logic fabric with substantial on-chip memory and extensive I/O to support complex, integrated system designs.

This device leverages the Virtex-II Pro platform architecture, which includes platform-level features such as embedded processor blocks and multi-gigabit transceiver support (as documented for the Virtex-II Pro family), making it suited for applications that require tight integration of logic, memory, and high-speed interfaces.

Key Features

• Logic Capacity — 43,632 logic elements (cells) organized across 4,848 CLBs to implement complex digital logic and custom datapaths.
• Embedded Memory — Approximately 3.54 Mbits of total on-chip RAM (3,538,944 bits) for buffering, tables, and state storage.
• I/O Density — 416 user I/O pins to support parallel interfaces, buses, and control signals in compact system designs.
• Platform-Level Capabilities — Virtex-II Pro family features documented in the product specification include support for embedded PowerPC processor blocks and RocketIO multi-gigabit transceivers (family-level capabilities; consult platform documentation for specific device configurations).
• DSP Resources — Dedicated multiplier blocks (18-bit × 18-bit) referenced in the platform documentation for efficient arithmetic and DSP implementations.
• Package & Mounting — 676-BGA package; supplier device package listed as 676-FBGA (27 × 27). Surface-mount assembly.
• Power and Thermal — Core supply range from 1.425 V to 1.575 V; commercial operating temperature range 0 °C to 85 °C.
• Compliance — RoHS compliant for material and environmental conformance.

Typical Applications

• Telecom & Datacom Equipment — Family-level multi-gigabit transceiver support and high I/O count enable implementation of serial links and interface aggregation in communications hardware.
• Embedded Processing Systems — Platform support for embedded processor blocks makes the device suitable for systems requiring on-chip RISC processing combined with programmable logic.
• High-Density Logic and Memory Integration — Large logic element count and several megabits of embedded RAM support custom datapaths, buffering, and packet processing.
• Custom Hardware Acceleration — Dedicated multiplier blocks and ample logic resources allow hardware offload of compute-intensive functions.

Unique Advantages

• High integration density: Large logic fabric and significant embedded RAM reduce external component count and simplify board-level design.
• Extensive I/O: 416 user I/Os provide flexibility for parallel interfaces, bus connections, and mixed-signal front-ends.
• Platform feature set: Virtex-II Pro platform documentation includes processor and transceiver capabilities that help consolidate system functions on a single device (see platform documentation for details).
• Commercial temperature rating: 0 °C to 85 °C operation aligns with a wide range of standard commercial electronics applications.
• RoHS compliance: Material compliance supports environmental and manufacturing requirements.

Why Choose XC2VP40-6FG676C?

The XC2VP40-6FG676C delivers a combination of high logic capacity, multi-megabit on-chip memory, and robust I/O that suits complex commercial designs requiring integrated processing and high-bandwidth interfaces. As a Virtex-II Pro platform device, it benefits from platform-level architecture and documentation that support embedded processing and transceiver options.

This device is well suited for engineering teams looking to consolidate functions, manage system-level integration, and leverage platform documentation and IP/reference support when implementing custom FPGA-based solutions.

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