XC2VP40-6FG676I
| Part Description |
Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 416 3538944 43632 676-BGA |
|---|---|
| Quantity | 797 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BGA | Number of I/O | 416 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4848 | Number of Logic Elements/Cells | 43632 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3538944 |
Overview of XC2VP40-6FG676I – Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 416 3538944 43632 676-BGA
The XC2VP40-6FG676I is a Virtex®-II Pro platform FPGA provided in a 676-ball BGA package. It combines a dense logic fabric, significant embedded memory, and a broad I/O count to address industrial and high-performance embedded applications.
Designed for systems that require integrated processing and high-speed serial capabilities at the device-family level, the Virtex-II Pro architecture supports configurable logic blocks, embedded processor options, and multi-gigabit transceiver functionality as part of the platform feature set.
Key Features
- Logic Fabric Approximately 43,632 logic elements and 4,848 CLBs (configurable logic blocks) for implementing complex digital logic and system functions.
- Embedded Memory Approximately 3.54 Mbits of on-chip RAM (total RAM bits: 3,538,944) for buffers, FIFOs, and state storage.
- On‑chip Processing and I/O Architecture Platform-level support for embedded processor blocks (up to two IBM PowerPC™ 405 cores are included in the Virtex-II Pro family specification) and dedicated resources such as 18-bit × 18-bit multiplier blocks and SelectRAM™ memory hierarchy.
- High‑density I/O 416 user I/Os to support complex interface requirements and system connectivity.
- Multi‑Gigabit Transceivers (Platform Feature) Virtex‑II Pro family architecture includes RocketIO™ multi‑gigabit transceivers (family-level capability) for high-speed serial links and telecom/datacom modes.
- Package & Mounting 676‑FBGA (27 × 27) supplier device package in a 676‑BGA case; surface-mount mounting type for high-density PCB integration.
- Power Supported core voltage supply range: 1.425 V to 1.575 V to match system power rails.
- Temperature & Grade Industrial grade with an operating temperature range of −40 °C to 100 °C.
- Compliance RoHS compliant.
Typical Applications
- Telecom & Datacom Systems Use the Virtex‑II Pro platform’s RocketIO multi‑gigabit transceiver capability and dense logic to implement high-speed serial interfaces and protocol processing.
- Embedded Processing & Control Suitable for embedded systems that can leverage on‑chip processor blocks and extensive logic/memory to consolidate functions and reduce external components.
- Industrial Automation Industrial-grade operation and wide temperature range support control, motor drive, and sensor‑interface applications in harsh environments.
- High‑I/O Systems Large I/O count and BGA package enable dense interface designs such as communication line cards, I/O concentrators, and complex interface bridging.
Unique Advantages
- Highly integrated platform: Combines configurable logic blocks, embedded memory, and platform-level processor/transceiver options to reduce external components and design complexity.
- Substantial on‑chip memory: Approximately 3.54 Mbits of embedded RAM supports large buffers, FIFOs, and local data storage for high-throughput designs.
- Dense logic capacity: 43,632 logic elements across 4,848 CLBs provide the capacity to implement complex algorithms, signal processing, and control logic.
- Extensive I/O and compact package: 416 I/Os in a 676‑FBGA (27 × 27) package support high I/O bandwidth in a compact footprint.
- Industrial robustness: Rated for −40 °C to 100 °C operation and RoHS compliant to meet industrial deployment requirements.
Why Choose XC2VP40-6FG676I?
The XC2VP40-6FG676I delivers a platform-level FPGA package that balances dense logic, sizable embedded memory, and extensive I/O in an industrial-grade device. Its Virtex‑II Pro architecture provides platform features such as configurable logic blocks, dedicated multiplier and memory resources, and family-level support for embedded processor blocks and multi‑gigabit transceivers—making it suitable for systems that require integration of processing, high-speed interfaces, and flexible logic.
This device is well suited to engineers designing industrial controls, telecom/datacom modules, and other high-density embedded applications that demand proven FPGA capabilities, predictable electrical characteristics, and broad platform-level feature support.
Request a quote or submit a purchase inquiry to check availability and pricing for the XC2VP40-6FG676I.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








