XC2VP40-6FG676I

IC FPGA 416 I/O 676FCBGA
Part Description

Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 416 3538944 43632 676-BGA

Quantity 797 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case676-BGANumber of I/O416Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4848Number of Logic Elements/Cells43632
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3538944

Overview of XC2VP40-6FG676I – Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 416 3538944 43632 676-BGA

The XC2VP40-6FG676I is a Virtex®-II Pro platform FPGA provided in a 676-ball BGA package. It combines a dense logic fabric, significant embedded memory, and a broad I/O count to address industrial and high-performance embedded applications.

Designed for systems that require integrated processing and high-speed serial capabilities at the device-family level, the Virtex-II Pro architecture supports configurable logic blocks, embedded processor options, and multi-gigabit transceiver functionality as part of the platform feature set.

Key Features

  • Logic Fabric  Approximately 43,632 logic elements and 4,848 CLBs (configurable logic blocks) for implementing complex digital logic and system functions.
  • Embedded Memory  Approximately 3.54 Mbits of on-chip RAM (total RAM bits: 3,538,944) for buffers, FIFOs, and state storage.
  • On‑chip Processing and I/O Architecture  Platform-level support for embedded processor blocks (up to two IBM PowerPC™ 405 cores are included in the Virtex-II Pro family specification) and dedicated resources such as 18-bit × 18-bit multiplier blocks and SelectRAM™ memory hierarchy.
  • High‑density I/O  416 user I/Os to support complex interface requirements and system connectivity.
  • Multi‑Gigabit Transceivers (Platform Feature)  Virtex‑II Pro family architecture includes RocketIO™ multi‑gigabit transceivers (family-level capability) for high-speed serial links and telecom/datacom modes.
  • Package & Mounting  676‑FBGA (27 × 27) supplier device package in a 676‑BGA case; surface-mount mounting type for high-density PCB integration.
  • Power  Supported core voltage supply range: 1.425 V to 1.575 V to match system power rails.
  • Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C.
  • Compliance  RoHS compliant.

Typical Applications

  • Telecom & Datacom Systems  Use the Virtex‑II Pro platform’s RocketIO multi‑gigabit transceiver capability and dense logic to implement high-speed serial interfaces and protocol processing.
  • Embedded Processing & Control  Suitable for embedded systems that can leverage on‑chip processor blocks and extensive logic/memory to consolidate functions and reduce external components.
  • Industrial Automation  Industrial-grade operation and wide temperature range support control, motor drive, and sensor‑interface applications in harsh environments.
  • High‑I/O Systems  Large I/O count and BGA package enable dense interface designs such as communication line cards, I/O concentrators, and complex interface bridging.

Unique Advantages

  • Highly integrated platform: Combines configurable logic blocks, embedded memory, and platform-level processor/transceiver options to reduce external components and design complexity.
  • Substantial on‑chip memory: Approximately 3.54 Mbits of embedded RAM supports large buffers, FIFOs, and local data storage for high-throughput designs.
  • Dense logic capacity: 43,632 logic elements across 4,848 CLBs provide the capacity to implement complex algorithms, signal processing, and control logic.
  • Extensive I/O and compact package: 416 I/Os in a 676‑FBGA (27 × 27) package support high I/O bandwidth in a compact footprint.
  • Industrial robustness: Rated for −40 °C to 100 °C operation and RoHS compliant to meet industrial deployment requirements.

Why Choose XC2VP40-6FG676I?

The XC2VP40-6FG676I delivers a platform-level FPGA package that balances dense logic, sizable embedded memory, and extensive I/O in an industrial-grade device. Its Virtex‑II Pro architecture provides platform features such as configurable logic blocks, dedicated multiplier and memory resources, and family-level support for embedded processor blocks and multi‑gigabit transceivers—making it suitable for systems that require integration of processing, high-speed interfaces, and flexible logic.

This device is well suited to engineers designing industrial controls, telecom/datacom modules, and other high-density embedded applications that demand proven FPGA capabilities, predictable electrical characteristics, and broad platform-level feature support.

Request a quote or submit a purchase inquiry to check availability and pricing for the XC2VP40-6FG676I.

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