XC2VP50-5FF1148C

The XC2VP50-5FF1148C is a Virtex-II Pro family FPGA provided by AMD. It combines a high logic capacity with abundant I/O and on-chip memory in a surface-mount 1148‑BBGA (1148‑FCPBGA, 35×35) package for commercial-grade embedded designs. Typical use cases include embedded processing, high-density I/O interfacing, and telecom/datacom applications that leverage platform-level transceiver and processor resources described in the Virtex-II Pro data sheet.

Key Features

• Logic Capacity — 53,136 logic elements (cells), enabling complex programmable logic implementations without external gate arrays.
• Embedded Memory — Approximately 4.28 Mbits of on-chip RAM (4,276,224 total RAM bits) for buffering, data storage, and on-chip fabric usage.
• I/O Density — 812 user I/Os, supporting extensive peripheral and board-level interfacing needs.
• Package & Mounting — Surface-mount 1148‑BBGA (supplier package: 1148‑FCPBGA, 35×35 mm) suitable for compact board designs.
• Power — Core supply voltage specified at 1.425 V to 1.575 V for power planning and supply design.
• Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Compliance — RoHS compliant.
• Platform-Level Capabilities — The Virtex-II Pro family specification describes integrated features such as embedded multi‑gigabit transceivers and processor block support, enabling platform architectures that combine logic, high-speed serial links, and embedded processing (see family data for details).

Typical Applications

• Embedded processing systems — Implements on‑chip processing and logic for control, protocol handling, and system management by leveraging Virtex-II Pro platform processor block capabilities.
• Telecom & Datacom — Suited for board‑level implementations that require many I/Os and platform transceiver support for telecom/datacom signaling and clocking modes.
• High-density I/O and interface bridging — 812 I/Os enable complex sensor, memory, and peripheral interfacing without extensive external multiplexing.

Unique Advantages

• High integration density: 53,136 logic elements and substantial on‑chip RAM reduce the need for external logic and memory components.
• Large I/O complement: 812 I/Os simplify board routing and allow direct connections to numerous peripherals and interfaces.
• Compact BGA package: 1148‑BBGA (35×35 mm) provides a balance of pin count and board area for high‑performance, space‑constrained designs.
• Commercial-grade operation: Rated for 0 °C to 85 °C, aligning with standard commercial embedded system requirements.
• Regulatory-friendly: RoHS compliance supports environmental and manufacturing requirements.

Why Choose XC2VP50-5FF1148C?

The XC2VP50-5FF1148C delivers a blend of substantial programmable logic, significant embedded memory, and high I/O count in a single surface-mount FCBGA package. It is well suited for customers building commercial embedded systems that require dense logic, flexible interfacing, and the platform-level capabilities documented for the Virtex‑II Pro family.

Designers seeking scalable FPGA resources in a compact package will find this device appropriate for applications ranging from embedded processing to telecom/datacom board designs where integration, available on‑chip memory, and abundant I/O are key considerations.

Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for the XC2VP50-5FF1148C. Our team will respond with a tailored quote and ordering details.