XC2VP50-5FF1152I

The XC2VP50-5FF1152I is a Virtex®-II Pro platform FPGA in a 1152-FCBGA (35×35) surface-mount package, offered in an industrial grade variant. It combines a large programmable logic fabric with substantial on-chip memory and a high I/O count to support complex embedded and system-level designs.

Designed for applications that require high logic capacity, flexible I/O and embedded memory, this device delivers SRAM-based, in-system configurability and family-level capabilities documented in the Virtex‑II Pro datasheet.

Key Features

• Logic Capacity — 53,136 logic elements to implement large combinational and sequential logic functions.
• Embedded Memory — Approximately 4.276 Mbits of on-chip RAM for buffering, FIFOs and embedded data storage.
• I/O Density — 692 user I/O pins to support wide parallel buses, memory interfaces and mixed-signal I/O schemes.
• Package & Mounting — 1152‑ball FCBGA (35×35) package in a surface-mount form factor for high-density PCB designs.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Supply Voltage — Core supply range of 1.425 V to 1.575 V to match required system power rails.
• Family-Level Platform Features — As described in the Virtex‑II Pro documentation: SRAM-based in-system configuration, dedicated 18×18 multiplier blocks, SelectRAM™ resources, and clock management circuitry.
• Standards & Compliance — RoHS compliant, supporting regulatory and manufacturing requirements for lead-free assembly.

Typical Applications

• Networking & Communications — Use the device’s high logic density and extensive I/O to implement packet processing, switching fabric, and protocol bridging.
• Industrial Automation — Industrial-grade temperature rating and abundant I/O make it suitable for motion control, machine vision interfaces and deterministic control logic.
• Embedded Processing Platforms — Family-level support for embedded processor blocks and on-chip memory enables system-on-chip style designs and real-time control functions.
• Prototyping & System Integration — Large logic and memory resources support complex prototype implementations and consolidation of multiple system functions into a single FPGA.

Unique Advantages

• High logic integration: 53,136 logic elements reduce the need for multiple discrete devices and simplify board-level routing.
• Significant embedded memory: Approximately 4.276 Mbits of RAM provides on-chip buffering and storage to accelerate data paths and reduce external memory dependence.
• Extensive I/O count: 692 user I/O pins enable broad connectivity for parallel interfaces, memory buses and mixed-signal I/O topologies.
• Industrial robustness: −40 °C to 100 °C operating range supports deployment in harsh or temperature-variable environments.
• Compact, manufacturable package: 1152‑ball FCBGA (35×35) surface-mount package balances routing density with assembly compatibility for production volumes.
• Regulatory readiness: RoHS compliance aligns with modern lead-free manufacturing processes.

Why Choose XC2VP50-5FF1152I?

The XC2VP50-5FF1152I provides a robust combination of logic capacity, embedded memory and high I/O density in an industrial-temperature FPGA package. It is well suited for designers looking to consolidate system functions, implement complex data-paths or deploy embedded processing solutions with on-chip resources.

Backed by the Virtex‑II Pro platform documentation and family-level features, this device offers an established architecture for scalable, reliable designs where integration, configurability and industrial-grade operation are required.

Request a quote or submit an inquiry to get pricing and availability for the XC2VP50-5FF1152I. Our team can provide lead-time information and support your volume or prototype requirements.