XC2VP50-5FFG1148C

The XC2VP50-5FFG1148C is a Virtex®-II Pro family FPGA offered by AMD. It delivers a high-density, SRAM-based programmable fabric designed for complex digital logic, system integration, and on-chip memory requirements.

As part of the Virtex-II Pro family, this device targets applications that require large logic capacity, substantial embedded memory, and high pin-count I/O, providing a balance of performance and integration for commercial embedded and communications designs.

Key Features

• Logic Capacity — 53,136 logic elements (cells) for implementing complex digital functions and custom accelerators.
• Configurable Logic Blocks (CLBs) — 5,904 CLBs to structure logic resources and support large-scale designs.
• Embedded Memory — Approximately 4.3 Mbits of on-chip RAM to support buffering, state storage, and local data processing.
• High I/O Count — 812 I/O pins to interface with multiple peripherals, buses, and external devices.
• Package and Mounting — 1148-ball BGA (FCBGA) package; supplier device package 1148-FCPBGA (35×35); surface-mount for PCB assembly.
• Power Supply — Core voltage range 1.425 V to 1.575 V to match system power rails and regulators.
• Operating Range — Commercial grade operation from 0 °C to 85 °C for standard embedded environments.
• RoHS Compliant — Meets RoHS requirements for material compliance.
• Family-Level Capabilities — As a Virtex-II Pro family member, the platform includes advanced features such as embedded processor blocks, RocketIO multi-gigabit transceivers, dedicated multipliers, and high-performance clock management (as described in the Virtex-II Pro family datasheet).

Typical Applications

• High-Speed Communications — Ideal for board-level designs requiring many I/Os and family-level support for multi-gigabit transceivers and telecom/datacom interfaces.
• Embedded System Integration — Suitable for designs that leverage on-chip processing blocks and extensive logic to consolidate functions onto a single FPGA-based system.
• Signal Processing and DSP — Large logic capacity, embedded RAM, and dedicated multiplier resources (family-level) enable custom signal-processing pipelines and data-path acceleration.
• Prototyping and Complex FPGA Designs — High resource counts and a 1148-ball FCBGA package make the device suitable for advanced prototyping and production-level FPGA implementations in commercial applications.

Unique Advantages

• High integration density: 53,136 logic elements and approximately 4.3 Mbits of embedded RAM reduce the need for external logic and memory chips.
• Extensive I/O connectivity: 812 I/Os support complex board-level interfacing and flexible system partitioning.
• Package options for dense PCBs: 1148-ball FCBGA (35×35) enables compact board layouts while delivering high pin-count access.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation to match standard commercial embedded environments.
• Predictable power envelope: Defined core supply range (1.425 V to 1.575 V) simplifies power-supply design and validation.
• RoHS compliance: Conforms to material requirements for environmentally conscious designs.

Why Choose XC2VP50-5FFG1148C?

The XC2VP50-5FFG1148C combines substantial logic density, significant embedded memory, and a high I/O count in a 1148-ball FCBGA package, making it well suited for commercial embedded and communications applications that require board-level consolidation and flexible I/O. Its family pedigree provides access to platform-level features—such as embedded processor blocks and high-speed transceiver technology—allowing designers to scale system integration and performance as needed.

Choose this device when you need a commercially rated FPGA with large on-chip resources, predictable power requirements, and a package optimized for high-density PCB integration. It offers a practical balance of capacity and system-level capability for teams targeting advanced FPGA-based solutions.

Request a quote or submit an inquiry to receive pricing and availability information for the XC2VP50-5FFG1148C.