XC2VP50-6FF1152C

The XC2VP50-6FF1152C is a Virtex®-II Pro FPGA in a 1152-FCBGA surface-mount package designed for systems that require significant programmable logic, embedded memory and high I/O density. The device combines a large logic fabric with on-chip memory and I/O resources to address applications that benefit from integration of programmable logic with processor and serial-transceiver capabilities described for the Virtex-II Pro family.

Key attributes include 53,136 logic elements, approximately 4.28 Mbits of embedded RAM, 692 I/Os, and support for family-level features such as embedded PowerPC processor blocks and RocketIO multi-gigabit transceivers. The device is supplied for commercial-grade applications and is RoHS compliant.

Key Features

• Logic Capacity — 53,136 logic elements to implement complex combinational and sequential logic functions.
• Embedded Memory — Approximately 4.28 Mbits of on-chip RAM for buffering, FIFOs and intermediate storage.
• I/O Resources — 692 general-purpose I/Os to support wide parallel interfaces and high signal-count systems.
• Processor & Transceiver Support (Family-Level) — Virtex-II Pro family documentation describes up to two embedded IBM PowerPC™ 405 processor blocks and up to twenty RocketIO or RocketIO X multi-gigabit transceivers for integrated processing and high-speed serial connectivity.
• Power — Core supply range 1.425 V to 1.575 V to match system power rails and design margins.
• Package & Mounting — 1152-FCBGA package (35 × 35 mm) in surface-mount format for compact, high-density board layouts.
• Operating Range & Grade — Commercial temperature range 0 °C to 85 °C; device is RoHS compliant.

Typical Applications

• Telecom and Datacom — Use with family-level RocketIO transceiver support for systems that need high-speed serial links and telecom/datacom protocol handling.
• Embedded Processing Systems — Integration of programmable logic with family-level PowerPC processor blocks enables offloading, control-plane functions and system orchestration.
• High-Density I/O Control — Large I/O count supports systems requiring extensive parallel interfaces such as switch fabrics, backplane bridging, and data acquisition front ends.
• Custom Logic Acceleration — Substantial logic elements and on-chip RAM for implementing application-specific accelerators, data path processing, and protocol engines.

Unique Advantages

• Integrated Processing and I/O: Family-level PowerPC processor blocks plus 692 I/Os enable consolidated system designs that reduce external components.
• High Logic Density: 53,136 logic elements provide headroom for large state machines, datapaths and control logic in a single device.
• Significant On-Chip Memory: Approximately 4.28 Mbits of embedded RAM supports buffering and local storage to improve throughput and reduce external memory needs.
• Multi-Gigabit Serial Support: Family documentation includes RocketIO transceivers for applications requiring high-speed serial connectivity and telecom/datacom modes.
• Compact, High-Density Package: 1152-FCBGA (35×35) surface-mount package enables dense board designs while exposing a large number of I/Os.
• Commercial-Grade and RoHS Compliant: Supports standard commercial temperature ranges and environmental compliance for mainstream production deployments.

Why Choose XC2VP50-6FF1152C?

The XC2VP50-6FF1152C positions itself as a capable platform FPGA for designs that need a combination of substantial programmable logic, embedded memory, and a high I/O count within a compact FCBGA package. With family-level support for embedded PowerPC processors and RocketIO multi-gigabit transceivers, this part is suited to integrators building systems that combine control, protocol handling and high-speed serial interfaces.

Engineers and procurement teams will find the XC2VP50-6FF1152C appropriate for commercial applications requiring robust logic resources, on-chip RAM and flexible I/O in a RoHS-compliant, surface-mount package with a defined operating voltage and temperature envelope.

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