XC2VP50-6FF1517I

The XC2VP50-6FF1517I is a high-density, industrial-grade FPGA built on the Virtex®-II Pro platform architecture. It combines large programmable logic capacity, substantial embedded memory, and broad I/O capability in a compact 1517-ball FCBGA package for demanding embedded and industrial designs.

This device is designed for systems requiring high logic density, extensive connectivity, and on-chip processing and transceiver options available within the Virtex‑II Pro family architecture. Key value comes from its large logic resource pool, multi-megabit embedded RAM, and wide operating temperature range.

Key Features

• Logic Capacity — Approximately 53,136 logic elements, supporting complex programmable logic implementations and high-density designs.
• Configurable Logic Blocks — 5,904 CLBs for structured logic resource partitioning and implementation.
• Embedded Memory — Approximately 4.28 Mbits of on-chip RAM for buffering, frame storage, and local data processing.
• High I/O Count — 852 user I/O pins to support dense external interfacing and multi-channel connectivity.
• Virtex‑II Pro Platform Features — Architecture-level features such as embedded 18-bit × 18-bit multipliers, digital clock management, and family support for RocketIO multi‑gigabit transceivers and on‑chip PowerPC processor blocks.
• Package and Mounting — 1517-ball FCBGA (1517-FCBGA, 40×40) surface-mount package for compact board integration.
• Power — Core supply specified at 1.425 V to 1.575 V for consistent voltage design planning.
• Industrial Temperature Grade — Rated for operation from −40°C to 100°C for robust performance in industrial environments.
• RoHS Compliant — Conforms to RoHS environmental requirements for lead-free assembly.

Typical Applications

• Industrial Control and Automation — High logic capacity and industrial temperature rating enable complex control algorithms, I/O aggregation, and deterministic processing in factory and process automation equipment.
• Embedded Processing Platforms — The Virtex‑II Pro family architecture includes on‑chip processor block options, making this device suitable for embedded control, protocol handling, and system orchestration tasks.
• High‑Density I/O Systems — With 852 I/O pins, the device supports large sensor arrays, multi-channel data acquisition, and dense peripheral interfacing.
• High‑Performance DSP and Signal Processing — Integrated multiplier resources and ample on‑chip RAM support filtering, transforms, and other numeric signal-processing workloads.

Unique Advantages

• High Logic Integration: Large logic element count enables consolidation of multiple functions into a single device, reducing board-level component count.
• Significant On‑Chip Memory: Approximately 4.28 Mbits of embedded RAM reduces external memory dependence for buffering and local storage.
• Extensive Connectivity: 852 I/O pins provide flexibility to interface with a wide range of peripherals and subsystems without additional bridge devices.
• Industrial Reliability: Industrial-grade temperature range (−40°C to 100°C) supports deployment in harsher environments.
• Compact Board Footprint: 1517-FCBGA (40×40) package delivers high resource density in a compact surface-mount form factor.
• Standards‑Aware Platform Features: Family architecture provides multi‑gigabit transceiver and embedded processor options for systems that require integrated serial links and on‑chip processing capability.

Why Choose XC2VP50-6FF1517I?

The XC2VP50-6FF1517I positions itself as a versatile, high-density FPGA option for industrial and embedded system designers who need substantial logic resources, multi-megabit embedded memory, and broad I/O in a compact package. Its Virtex‑II Pro platform heritage brings architecture-level features such as dedicated multipliers and clock management that support complex digital signal processing and system integration tasks.

Choose this device when you need a robust, scalable programmable solution for industrial control, embedded processing, high-density I/O aggregation, or DSP-intensive applications where on-chip resources and an industrial temperature rating matter for long-term deployment.

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