XC2VP50-6FF1152I

The XC2VP50-6FF1152I is a Virtex®-II Pro field programmable gate array (FPGA) in a 1152‑ball FCBGA package. It delivers high logic capacity, substantial embedded memory, and a large I/O count in an industrial‑grade, surface‑mount package.

As a member of the Virtex‑II Pro family, the platform architecture supports integrated processor and multi‑gigabit transceiver options and SRAM‑based in‑system configuration. Typical design focuses include logic‑intensive processing, on‑chip memory buffering, and high I/O connectivity in industrial temperature environments.

Key Features

• Logic Capacity — 53,136 logic elements to implement complex digital functions and custom processing pipelines.
• Embedded Memory — Approximately 4.276 Mbits of on‑chip RAM for buffering, FIFOs, and distributed storage.
• I/O Density — 692 user I/O pins to support high‑pin‑count external interfaces and parallel buses.
• Virtex‑II Pro Family Capabilities — Family features include support for embedded PowerPC™ processor blocks and RocketIO™ multi‑gigabit transceivers as documented in the Virtex‑II Pro series datasheet.
• Package — 1152‑ball FCBGA (35 × 35) surface‑mount package for dense board integration and routing efficiency.
• Power — Core supply range of 1.425 V to 1.575 V for regulated core operation.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• RoHS Compliant — Conforms to RoHS requirements for lead‑free assembly processes.

Typical Applications

• High‑density logic implementations — Use the 53,136 logic elements and abundant embedded RAM to implement complex state machines, protocol stacks, and custom accelerators.
• I/O‑intensive systems — Leverage 692 I/O pins for multi‑lane parallel interfaces, large sensor arrays, or extensive peripheral connectivity.
• Embedded processing platforms — Applicable where on‑chip processor resources from the Virtex‑II Pro family (PowerPC blocks) are used alongside FPGA logic for mixed compute tasks.
• High‑speed serial and communication links — Target applications that require family‑level multi‑gigabit transceiver support (RocketIO) for serialized interfaces and board‑level data movement.

Unique Advantages

• High logic density: 53,136 logic elements enable substantial on‑chip logic integration and consolidation of discrete components.
• Significant embedded memory: Approximately 4.276 Mbits of RAM reduce external memory dependency for buffering and real‑time data handling.
• Extensive I/O count: 692 I/Os allow flexible interfacing to numerous peripherals, sensors, and parallel data paths.
• Industrial temperature rating: −40 °C to 100 °C supports reliable operation in demanding environments.
• Compact, dense packaging: 1152‑ball FCBGA (35×35) supports compact board layouts while maintaining high connectivity.
• Standards‑aware family features: The Virtex‑II Pro family includes embedded processor blocks and multi‑gigabit transceivers, enabling integrated system designs when those features are required.

Why Choose XC2VP50-6FF1152I?

The XC2VP50-6FF1152I positions itself as a high‑capacity, industrial‑grade FPGA suited for designs that demand a combination of large logic resources, on‑chip memory, and broad I/O connectivity. Its FCBGA packaging and core voltage range support compact, regulated board implementations, while the Virtex‑II Pro family heritage provides additional platform options such as embedded processors and high‑speed serial transceivers at the family level.

This device is appropriate for engineers and procurement teams building logic‑dense systems, I/O‑heavy platforms, or embedded processing solutions that require industrial temperature operation and RoHS compliance. The available datasheet and family documentation provide detailed electrical, timing, and configuration guidance for system integration.

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