XC2VP50-6FFG1152C

The XC2VP50-6FFG1152C is a Virtex®-II Pro Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 1152‑FCBGA (35×35) package. It combines a high logic capacity and on‑chip memory with a large I/O complement and the power/thermal characteristics suitable for commercial‑grade embedded designs.

This device targets applications that require substantial programmable logic, significant embedded RAM, and extensive I/O connectivity while operating within a standard commercial temperature range.

Key Features

• Logic Capacity — 53,136 logic elements to implement complex digital designs and custom processing pipelines.
• Embedded Memory — Approximately 4.28 Mbits of embedded memory (4,276,224 bits) for buffering, FIFOs, and on‑chip data storage.
• I/O — 692 user I/O pins providing broad external interface and high fan‑out connectivity options.
• Power — Core voltage supply range 1.425 V to 1.575 V, supporting stable operation within specified supply limits.
• Package — 1152‑FCBGA (35×35) package case designed for high‑density board routing and thermal performance.
• Operating Range — Commercial grade operation from 0 °C to 85 °C.
• RoHS Compliance — RoHS compliant for environmentally conscious design and supply chain requirements.
• Virtex‑II Pro Family Capabilities — Family‑level features include embedded PowerPC processor block options, RocketIO™ multi‑gigabit transceiver technology, dedicated 18×18 multipliers, digitally controlled impedance I/O, and SelectRAM™ memory hierarchy as documented in the Virtex‑II Pro datasheet.

Typical Applications

• Telecom & Datacom — High I/O count and family support for RocketIO multi‑gigabit transceivers make this device suitable for communications endpoints, interface bridging, and packet processing functions.
• Embedded Processing — Family features that include embedded PowerPC processor blocks enable system integration where on‑chip processing and hardware acceleration are required.
• Signal Processing — Substantial logic element count, dedicated multiplier resources, and embedded RAM support filtering, DSP pipelines, and custom data‑path implementations.
• High‑Density I/O Systems — 692 I/Os and a 1152‑FCBGA package facilitate dense board designs needing many external interfaces or parallel buses.

Unique Advantages

• High programmable capacity: 53,136 logic elements provide the headroom for complex, multi‑function designs.
• Significant on‑chip memory: Approximately 4.28 Mbits of embedded RAM reduces dependence on external memory for many buffering and temporary storage tasks.
• Extensive I/O availability: 692 user I/O pins simplify integration with peripherals, transceivers, and parallel interfaces.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation for a wide range of standard‑environment applications.
• Package density: 1152‑FCBGA (35×35) supports compact, high‑density PCB layouts while accommodating the device’s pin count.
• Standards‑aware family features: Virtex‑II Pro family documentation describes multi‑gigabit transceivers, embedded processor blocks, and dedicated multiplier and memory resources useful for system designers.

Why Choose XC2VP50-6FFG1152C?

The XC2VP50-6FFG1152C provides a balance of high logic density, substantial embedded memory, and a large number of I/Os in a commercial‑grade Virtex‑II Pro FPGA package. It is suited for engineers who need on‑chip resources to consolidate functions, reduce external components, and implement complex data‑path and control logic within a single device.

With family documentation that includes processor block descriptions, multi‑gigabit transceiver capabilities, and a mature FPGA architecture, this device offers a documented platform for designs that require programmable logic combined with advanced interfacing and embedded memory resources.

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