XC2VP50-7FFG1517C

The XC2VP50-7FFG1517C is a Virtex®-II Pro family FPGA in a 1517-ball flip-chip BGA (1517-FCBGA, 40×40) package designed for surface-mount applications. It combines a high logic capacity and large embedded memory with a high I/O count and precise supply requirements to support complex, high-density digital designs.

Targeted at commercial applications that require extensive programmable logic, on-chip RAM and broad I/O connectivity, this device delivers a compact, RoHS-compliant platform for embedded signal processing, high‑density I/O interfacing and advanced system integration.

Key Features

• Logic Capacity — 5,904 CLBs delivering 53,136 logic cells for implementing large-scale digital designs and complex state machines.
• Embedded Memory — Approximately 4.28 Mbits (4,276,224 bits) of on-chip RAM to support buffering, lookup tables and embedded data structures.
• I/O Density — 852 user I/O pins to accommodate wide bus interfaces, multiple parallel peripherals and high-pin-count connectivity.
• Power Supply — Core supply range of 1.425 V to 1.575 V to match modern FPGA power rails and design margins.
• Package & Mounting — 1517-FCBGA (40×40) ball-grid flip-chip package, surface mount for compact board-level integration.
• Operating Range — Commercial operating temperature from 0 °C to 85 °C for standard commercial deployments.
• Regulatory — RoHS compliant.
• Family Architecture Highlights — As a Virtex‑II Pro platform member, the family includes options such as embedded multi‑gigabit transceivers and dedicated processor blocks (PowerPC) in family devices, plus dedicated multiplier and block memory resources noted in the platform datasheet.

Typical Applications

• Embedded Processing Systems — Use the device’s large logic capacity and embedded memory to implement custom processors, hardware accelerators and control subsystems.
• High‑Density I/O Interfaces — Leverage 852 I/Os for multi-channel data acquisition, wide parallel buses or dense peripheral aggregation.
• Communications & Networking — Suitable for protocol handling, framing and buffering tasks that benefit from the family’s transceiver and memory architecture.
• Signal Processing — On‑chip RAM and extensive logic resources support medium-scale DSP pipelines, filtering and custom data-path implementations.

Unique Advantages

• Substantial Logic Resources: 53,136 logic cells and 5,904 CLBs enable large, complex designs without immediate need for multi‑device solutions.
• Significant Embedded Memory: Approximately 4.28 Mbits of on‑chip RAM reduces external memory dependency and lowers board-level BOM complexity.
• High I/O Count: 852 I/Os provide flexibility for dense connectivity and multiple parallel interfaces on a single device.
• Compact FCBGA Package: 1517‑ball flip‑chip BGA provides high pin density in a space-efficient footprint for constrained PCB layouts.
• Commercial Temperature Suitability: Rated 0 °C to 85 °C for standard commercial deployments where this temperature range is required.
• RoHS Compliant: Meets environmental compliance needs for modern electronics production.

Why Choose XC2VP50-7FFG1517C?

The XC2VP50-7FFG1517C positions itself as a high-capacity, commercially graded FPGA option within the Virtex‑II Pro family, combining extensive logic and memory with a very high I/O count in a compact FCBGA package. It is well suited for engineering teams building complex embedded systems, communications interfaces or high‑density I/O modules that require significant on-chip resources while maintaining a compact board footprint.

Designers benefit from the device’s integration of logic, memory and I/O density to consolidate functionality, reduce the number of external components and simplify system architecture. The Virtex‑II Pro family ecosystem and documented architecture provide a clear upgrade and support path for projects requiring platform-level capabilities.

Request a quote or submit an RFQ to obtain pricing and availability for XC2VP50-7FFG1517C. Our team will respond with product and ordering information tailored to your requirements.