XC2VP50-6FFG1152I

IC FPGA 692 I/O 1152FCBGA
Part Description

Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 692 4276224 53136 1152-BBGA, FCBGA

Quantity 663 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O692Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs5904Number of Logic Elements/Cells53136
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4276224

Overview of XC2VP50-6FFG1152I – Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 692 I/O, ~4.28 Mbits RAM, 53136 logic elements, 1152-FCBGA

The XC2VP50-6FFG1152I is a Virtex®-II Pro platform FPGA provided in a 1152‑ball FCBGA package. This SRAM-based FPGA integrates a large logic fabric and embedded memory, delivering a flexible, reprogrammable platform for embedded-processing and high-density I/O applications.

Designed for industrial-grade deployments, the device offers substantial logic resources, a high I/O count and support for the Virtex‑II Pro family features such as on-chip processor blocks and multi-gigabit transceiver capabilities described in the product specification.

Key Features

  • Logic Capacity: 53136 logic elements to implement complex combinational and sequential logic.
  • Embedded Memory: Approximately 4.28 Mbits of on-chip RAM for buffering, state storage and memory-intensive logic.
  • I/O Density & Package: 692 user I/O pins in a 1152‑ball FCBGA (35×35) package, supporting high interface density in a single surface-mount footprint.
  • Platform Architecture: Virtex‑II Pro family architecture with platform-level features including configurable logic blocks, SelectRAM memory hierarchy, and advanced clock management as outlined in the product specification.
  • On-Chip Processing & Transceivers: Family-level support for embedded PowerPC™ 405 processor blocks and RocketIO multi-gigabit transceivers (family capabilities described in the datasheet).
  • Power Supply Range: Core supply range of 1.425 V to 1.575 V for defined operating conditions.
  • Industrial Temperature Rating: Specified operating range from −40 °C to 100 °C for industrial applications.
  • Compliance: RoHS compliant.

Typical Applications

  • Telecom / Datacom Systems: High I/O count and family support for RocketIO transceivers enable deployments that require dense serial interfaces and telecom/datacom protocols.
  • Embedded Processing Platforms: On-chip PowerPC processor block support and abundant logic/memory make the device suitable for embedded controller and system-on-chip style implementations.
  • High‑Bandwidth Interface Hubs: Large logic capacity and substantial on-chip RAM support data buffering, protocol bridging and complex interface aggregation.
  • Industrial Control & Automation: Industrial temperature rating and robust I/O count allow use in control systems that require extended temperature operation and extensive sensor/actuator connectivity.

Unique Advantages

  • Substantial Logic Resources: 53136 logic elements provide headroom for complex algorithms, signal processing and control logic without external ASICs.
  • Significant Embedded Memory: Approximately 4.28 Mbits of on-chip RAM reduces reliance on external memory for many buffering and stateful tasks.
  • High I/O Count in a Compact Package: 692 I/Os in a 1152‑ball FCBGA (35×35) delivers a high interface density in a surface-mount package suitable for compact board layouts.
  • Industrial Temperature Range: Rated from −40 °C to 100 °C for reliable operation in industrial environments.
  • Platform-Level Integration: Virtex‑II Pro family features such as embedded processor blocks and multi-gigabit transceiver support provide integration options that can reduce external components and BOM complexity.
  • RoHS Compliant: Conforms to RoHS requirements for environmentally conscious designs.

Why Choose XC2VP50-6FFG1152I?

The XC2VP50-6FFG1152I combines a high logic count, substantial on-chip memory and a very high I/O density in a single industrial‑rated FCBGA package. Its Virtex‑II Pro platform heritage brings family-level features—embedded processor blocks, multi-gigabit transceiver support and advanced clocking—that help simplify system design and integration for embedded and telecom applications.

This device is well suited to designers needing a flexible, reprogrammable platform with robust logic and memory resources, dense interfacing and industrial temperature capability. It is a practical choice for applications where consolidation of processing, interface logic and buffering into a single FPGA reduces board complexity and supports long-term design scalability.

If you would like pricing, availability or to submit a parts request, please request a quote with your desired quantity and delivery requirements and our team will respond with a tailored quotation.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up