XC2VP50-7FF1152C

IC FPGA 692 I/O 1152FCBGA
Part Description

Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 692 4276224 53136 1152-BBGA, FCBGA

Quantity 264 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FCBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O692Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs5904Number of Logic Elements/Cells53136
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4276224

Overview of XC2VP50-7FF1152C – Virtex®-II Pro Field Programmable Gate Array, 1152-FCBGA

The XC2VP50-7FF1152C is a Virtex-II Pro platform FPGA in a 1152-ball flip-chip BGA (1152-FCBGA, 35×35) package designed for high-density, system-level integration. It combines a large logic fabric with substantial on-chip memory and a high I/O count, making it suitable for embedded processing, high-speed interfacing, and complex digital signal tasks.

Key architectural highlights include 53,136 logic elements, approximately 4.28 Mbits of embedded memory, and 692 user I/Os. The device is specified for commercial-grade operation with a core supply range of 1.425 V to 1.575 V and an operating temperature range of 0 °C to 85 °C.

Key Features

  • Logic Capacity  53,136 logic elements provide substantial programmable logic for mid-to-high complexity designs.
  • Embedded Memory  Approximately 4.28 Mbits of on-chip RAM for buffering, lookup tables, and packet or data storage.
  • I/O Density  692 user I/Os in the 1152-FCBGA package support high-pin-count interfaces and mixed-signal board routing strategies.
  • FPGA Platform Capabilities  Based on the Virtex-II Pro architecture; series-level features include integrated PowerPC processor blocks and RocketIO multi-gigabit transceivers (as described in the family datasheet).
  • DSP Resources  Dedicated multiplier resources (18-bit × 18-bit blocks referenced in the platform datasheet) for arithmetic- and DSP-intensive functions.
  • Clock and Routing  High-performance clock management and routing fabric referenced in the platform documentation to support complex timing structures.
  • Package & Mounting  1152-FCBGA (35×35) flip-chip BGA, surface-mount mounting for compact, high-density board designs.
  • Electrical & Environmental  Core voltage specified at 1.425 V to 1.575 V; commercial operating temperature range 0 °C to 85 °C; RoHS compliant.

Typical Applications

  • Embedded Processing Systems  Use the Virtex-II Pro platform to implement system-on-chip architectures that leverage embedded processor blocks and programmable logic for custom control and offload functions.
  • Telecommunications & Networking  High I/O count and family-level RocketIO transceiver support (per platform datasheet) make the device suitable for interface bridging, protocol adaptation, and high-density packet processing.
  • Signal Processing  On‑chip RAM and dedicated multiplier resources enable filtering, transforms, and other DSP tasks in radar, comms, and instrumentation designs.
  • Prototyping & Complex Logic Integration  Large logic element count and extensive I/O facilitate board-level consolidation and rapid hardware prototyping for complex digital systems.

Unique Advantages

  • Substantial Logic Resources: The 53,136 logic elements support high-density logic implementations without immediate need for external logic expansion.
  • Integrated Memory: Approximately 4.28 Mbits of embedded RAM reduces reliance on external memory for many control, buffering, and data-path applications.
  • High I/O Count: 692 I/Os in a single-package solution enables direct interfacing to multiple buses, connectors, and peripherals, simplifying board-level routing.
  • Platform-Level Features: Virtex-II Pro family architecture (per datasheet) provides processor block and multi-gigabit transceiver options for mixed compute and high-speed I/O designs.
  • Commercial Temperature Rating: Specified 0 °C to 85 °C operation aligns the device with mainstream commercial and enterprise electronics applications.
  • RoHS Compliant: Meets environmental regulations for lead-free manufacturing and supply chain compliance.

Why Choose XC2VP50-7FF1152C?

The XC2VP50-7FF1152C positions itself as a versatile Virtex-II Pro platform FPGA for designs that require a balance of logic density, embedded memory, and high I/O capacity. Its combination of 53,136 logic elements, approximately 4.28 Mbits of on-chip RAM, and 692 I/Os in a 1152-FCBGA package makes it well suited to embedded processing, telecom interfaces, and DSP-centric applications.

Engineers and procurement teams seeking a commercial-grade FPGA with platform-level capabilities documented in the Virtex-II Pro family datasheet will find the XC2VP50-7FF1152C a practical choice for consolidating board-level functions and accelerating time-to-prototype.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the XC2VP50-7FF1152C.

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