XC2VP7-5FF672I

The XC2VP7-5FF672I is a Virtex®-II Pro platform field-programmable gate array (FPGA) offered by AMD. It delivers flexible, SRAM-based FPGA logic resources in a 672-ball FCBGA package targeted at industrial applications requiring significant I/O density and on-chip memory.

As a member of the Virtex-II Pro family, the device aligns with the platform's architecture that supports embedded processing and high-performance transceiver and I/O options across the family. This part provides a balance of logic capacity, embedded memory, and interface density for system-level integration.

Key Features

• Logic Capacity  Approximately 11,088 logic elements, providing ample combinational and sequential resources for medium-complexity FPGA designs.
• Embedded Memory  Approximately 0.81 Mbits of on-chip RAM for data buffering, FIFOs, and local storage.
• I/O Density  396 user I/O pins to support wide parallel interfaces and multi-channel connectivity in a single device.
• Package and Mounting  672-ball FCBGA package (672-FCBGA, 27 × 27 mm) with surface-mount mounting for compact board-level integration.
• Power Supply  Core supply range of 1.425 V to 1.575 V to match system power rail planning and regulator selection.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Family-Level Architecture  Virtex-II Pro platform features such as embedded processor blocks, RocketIO multi-gigabit transceivers, digitally controlled impedance (DCI) I/O, dedicated 18 × 18 multipliers, and digital clock management (as described for the Virtex‑II Pro family).
• Standards and Environmental  RoHS-compliant manufacturing.

Typical Applications

• Telecommunications & Datacom  High I/O density and the Virtex-II Pro family’s transceiver capabilities make this device suitable for interface bridging, protocol processing, and line card functions.
• Embedded Processing & Control  Use in systems that benefit from FPGA-based custom logic with optional embedded processor resources available in the Virtex-II Pro family.
• Industrial Automation  Industrial temperature rating and extensive I/O support sensor aggregation, motor control interfaces, and real-time signal conditioning.
• High-Density Interface Conversion  Large I/O count and on-chip memory support parallel bus bridging, custom protocol adapters, and multi-channel data aggregation.

Unique Advantages

• Balanced Integration: Combines substantial logic resources with embedded RAM and DSP multiplier blocks to implement control, data-path, and buffering functions on a single device.
• High I/O Count: 396 I/Os reduce the need for external I/O expanders and simplify board-level routing for multi-interface designs.
• Compact Package: 672-FCBGA (27 × 27 mm) package allows dense placement on modern PCBs while maintaining routing capacity for many signals.
• Industrial Robustness: −40 °C to 100 °C operating range enables deployment in harsh or temperature-variable environments.
• Platform Ecosystem: As part of the Virtex-II Pro family, the device benefits from documented platform architecture elements such as embedded processor support, clock management, and high-speed transceiver technology.
• Regulatory Compliance: RoHS compliance supports environmentally conscious manufacturing and assembly processes.

Why Choose XC2VP7-5FF672I?

The XC2VP7-5FF672I provides a practical combination of logic capacity, embedded memory, and extensive I/O in a compact industrial-grade FCBGA package. It is well suited to designers who need to consolidate multiple functions—control, data buffering, and complex interfacing—into a single FPGA device while operating across a broad temperature range.

Positioned within the Virtex-II Pro platform, this part gives engineers access to family-level features such as embedded processing and high-speed I/O building blocks, enabling scalable designs and reducing external component count for streamlined systems.

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