XC2VP7-5FFG672I

The XC2VP7-5FFG672I is a Virtex®-II Pro family field-programmable gate array (FPGA) supplied in a 672-ball flip-chip BGA package (672-FCBGA, 27×27). This industrial-grade, surface-mount device delivers a balance of programmable logic, embedded memory and high I/O density for demanding embedded and communications-oriented designs.

With approximately 11,088 logic elements, roughly 0.811 Mbits of embedded RAM, and 396 I/O pins, the device is aimed at applications that require substantial on-chip resources and reliable operation across an extended temperature range.

Key Features

• Logic Capacity  Approximately 11,088 logic elements to implement custom logic, state machines and control functions.
• Embedded Memory  Approximately 0.811 Mbits of on-chip RAM for data buffering, FIFOs and on-chip storage.
• I/O and Packaging  396 user I/O pins in a 672-BBGA / FCBGA (27×27) footprint; surface-mount package suitable for dense board layouts.
• Power Supply  Core voltage supply range of 1.425 V to 1.575 V to match platform power rails.
• Temperature and Grade  Industrial-grade device rated for operation from −40°C to 100°C.
• Family Architecture (Virtex-II Pro)  As a member of the Virtex-II Pro family, the device benefits from platform features described in the family datasheet, including embedded processor blocks, multi-gigabit transceiver capability, dedicated multiplier blocks, and clock management resources.
• Standards & Compliance  RoHS-compliant supply status for lead-free assembly processes.

Typical Applications

• Communications Infrastructure  Implement protocol processing, parallel/serial interface bridging and I/O-rich functions using the device’s high pin count and family transceiver/processor capabilities.
• Embedded Processing  Combine custom hardware accelerators with on-chip RAM and the Virtex-II Pro family’s embedded processor options for system control and offload tasks.
• Industrial Control  Use the industrial temperature rating and flexible I/O for factory automation, motion control and real-time signal processing.

Unique Advantages

• High Logic Density: ~11,088 logic elements provide substantial gate-equivalent resources for complex designs without external RTL partitioning.
• Significant On-Chip Memory: Approximately 0.811 Mbits of embedded RAM reduces dependence on external memory for buffering and temporary storage.
• Large I/O Count: 396 I/O pins enable broad peripheral connectivity and parallel interfaces directly from the FPGA package.
• Industrial Temperature Range: Rated from −40°C to 100°C to support deployment in harsh or temperature-variable environments.
• Platform-Level Capabilities: As part of the Virtex-II Pro family, the device aligns with a proven architecture offering on-chip multipliers, clock management, and embedded processor/transceiver support described in the family datasheet.
• RoHS Compliance: Meets RoHS environmental requirements for lead-free manufacturing.

Why Choose XC2VP7-5FFG672I?

The XC2VP7-5FFG672I positions itself as an industrial-grade FPGA solution combining meaningful logic capacity, embedded memory and a high I/O count in a compact 672-ball FCBGA package. It is a suitable choice for system designers who need on-chip resources and a platform that leverages the Virtex-II Pro family’s architectural features.

For designs that demand scalability, robust thermal performance and compatibility with established FPGA toolchains and reference materials, this device offers verifiable on-chip resources and family-level capabilities to accelerate development and integration.

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