XC2VP7-5FGG456C

IC FPGA 248 I/O 456FBGA
Part Description

Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 248 811008 11088 456-BBGA

Quantity 345 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package456-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case456-BBGANumber of I/O248Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1232Number of Logic Elements/Cells11088
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits811008

Overview of XC2VP7-5FGG456C – Virtex®-II Pro Field Programmable Gate Array (FPGA)

The XC2VP7-5FGG456C is a Virtex®-II Pro family FPGA offered by AMD, delivering a flexible, SRAM-based programmable fabric for embedded processing and high-performance I/O applications. The device integrates configurable logic resources, on-chip memory, and broad I/O capability in a 456-ball BGA package for surface-mount board designs.

Suitable for designs that require embedded memory, substantial logic capacity, and a range of I/O, the XC2VP7-5FGG456C provides a platform-level feature set drawn from the Virtex-II Pro family—including multi-gigabit transceiver support and processor-block integration—backed by configuration and clock-management primitives described in the family datasheet.

Key Features

  • Logic Capacity — 11,088 logic elements and 1,232 configurable logic block units (CLBs) to implement complex digital functions and custom logic architectures.
  • Embedded Memory — Approximately 0.811 Mbits of on-chip RAM (811,008 total RAM bits) for buffering, state storage, and multi-function data paths.
  • I/O Resources — 248 user I/O pins to support diverse interfacing and board-level connectivity requirements.
  • Processor and Transceiver Family Features — Virtex-II Pro family capabilities include support for up to two embedded PowerPC™ processor blocks and up to twenty RocketIO/RocketIO X multi-gigabit transceivers, as documented in the family specification.
  • Dedicated DSP and Memory Primitives — Family-level support for 18-bit × 18-bit multiplier blocks and SelectRAM™/SelectRAM+ memory hierarchies for DSP and arithmetic-intensive tasks.
  • Clock and I/O Management — On-chip clock management (Digital Clock Manager) and SelectI/O™-Ultra technology plus digitally controlled impedance (DCI) and on-chip differential termination described for the family.
  • Package and Mounting — 456-ball BGA (supplier device package: 456-FBGA, 23 × 23) in a surface-mount form factor suitable for compact PCB layouts.
  • Power and Operating Range — Core supply range 1.425 V to 1.575 V; commercial operating temperature range 0 °C to 85 °C.
  • Compliance — RoHS compliant.

Typical Applications

  • High-Speed Communications — Implements protocol engines and interface logic that can leverage the Virtex-II Pro family’s RocketIO/RocketIO X transceiver architecture for telecom and datacom systems.
  • Embedded Processing — Integrates application-specific control and data-processing tasks using the family’s processor-block options and programmable logic.
  • Signal Processing and DSP — Uses on-chip block RAM and 18×18 multipliers for real-time filtering, transforms, and arithmetic-heavy algorithms.
  • Prototyping and System Integration — Provides a programmable platform for hardware proof-of-concept, algorithm validation, and integration of custom peripherals with up to 248 I/O pins.

Unique Advantages

  • Balanced Logic and Memory — A combination of 11,088 logic elements and approximately 0.811 Mbits of embedded RAM supports control logic and data buffering without immediate external memory dependence.
  • Family-Level Processing and High-Speed I/O — Access to Virtex-II Pro family features such as embedded processor blocks and multi-gigabit transceivers enables integration of complex subsystems on a single FPGA platform.
  • Flexible I/O Count — 248 I/O pins provide room for diverse peripheral interfaces and board-level signal routing choices.
  • Compact Surface-Mount Package — 456-ball BGA (23 × 23) packaging supports dense PCB layouts while maintaining broad I/O and power delivery options.
  • Commercial Temperature Rating — Specified operation from 0 °C to 85 °C for typical commercial applications and environments.
  • RoHS Compliance — Conforms to RoHS requirements to support contemporary manufacturing and assembly processes.

Why Choose XC2VP7-5FGG456C?

The XC2VP7-5FGG456C delivers a practical blend of logic capacity, embedded memory, and I/O resources in a Virtex-II Pro family FPGA footprint. Its family-level features—documented processor integration, high-performance transceiver options, DSP primitives, and clock-management circuitry—make the device a capable platform for communications, embedded processing, and signal-processing applications where a programmable, in-system configurable solution is required.

Engineers and procurement teams looking for a commercially graded, RoHS-compliant FPGA in a 456-ball BGA package will find the XC2VP7-5FGG456C suitable for compact system designs that leverage the Virtex-II Pro architecture and its documented on-chip resources.

Request a quote or submit an inquiry to start procurement and learn about availability and pricing for the XC2VP7-5FGG456C.

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