XC2VP7-5FGG456C
| Part Description |
Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 248 811008 11088 456-BBGA |
|---|---|
| Quantity | 345 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 456-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 456-BBGA | Number of I/O | 248 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1232 | Number of Logic Elements/Cells | 11088 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 811008 |
Overview of XC2VP7-5FGG456C – Virtex®-II Pro Field Programmable Gate Array (FPGA)
The XC2VP7-5FGG456C is a Virtex®-II Pro family FPGA offered by AMD, delivering a flexible, SRAM-based programmable fabric for embedded processing and high-performance I/O applications. The device integrates configurable logic resources, on-chip memory, and broad I/O capability in a 456-ball BGA package for surface-mount board designs.
Suitable for designs that require embedded memory, substantial logic capacity, and a range of I/O, the XC2VP7-5FGG456C provides a platform-level feature set drawn from the Virtex-II Pro family—including multi-gigabit transceiver support and processor-block integration—backed by configuration and clock-management primitives described in the family datasheet.
Key Features
- Logic Capacity — 11,088 logic elements and 1,232 configurable logic block units (CLBs) to implement complex digital functions and custom logic architectures.
- Embedded Memory — Approximately 0.811 Mbits of on-chip RAM (811,008 total RAM bits) for buffering, state storage, and multi-function data paths.
- I/O Resources — 248 user I/O pins to support diverse interfacing and board-level connectivity requirements.
- Processor and Transceiver Family Features — Virtex-II Pro family capabilities include support for up to two embedded PowerPC™ processor blocks and up to twenty RocketIO/RocketIO X multi-gigabit transceivers, as documented in the family specification.
- Dedicated DSP and Memory Primitives — Family-level support for 18-bit × 18-bit multiplier blocks and SelectRAM™/SelectRAM+ memory hierarchies for DSP and arithmetic-intensive tasks.
- Clock and I/O Management — On-chip clock management (Digital Clock Manager) and SelectI/O™-Ultra technology plus digitally controlled impedance (DCI) and on-chip differential termination described for the family.
- Package and Mounting — 456-ball BGA (supplier device package: 456-FBGA, 23 × 23) in a surface-mount form factor suitable for compact PCB layouts.
- Power and Operating Range — Core supply range 1.425 V to 1.575 V; commercial operating temperature range 0 °C to 85 °C.
- Compliance — RoHS compliant.
Typical Applications
- High-Speed Communications — Implements protocol engines and interface logic that can leverage the Virtex-II Pro family’s RocketIO/RocketIO X transceiver architecture for telecom and datacom systems.
- Embedded Processing — Integrates application-specific control and data-processing tasks using the family’s processor-block options and programmable logic.
- Signal Processing and DSP — Uses on-chip block RAM and 18×18 multipliers for real-time filtering, transforms, and arithmetic-heavy algorithms.
- Prototyping and System Integration — Provides a programmable platform for hardware proof-of-concept, algorithm validation, and integration of custom peripherals with up to 248 I/O pins.
Unique Advantages
- Balanced Logic and Memory — A combination of 11,088 logic elements and approximately 0.811 Mbits of embedded RAM supports control logic and data buffering without immediate external memory dependence.
- Family-Level Processing and High-Speed I/O — Access to Virtex-II Pro family features such as embedded processor blocks and multi-gigabit transceivers enables integration of complex subsystems on a single FPGA platform.
- Flexible I/O Count — 248 I/O pins provide room for diverse peripheral interfaces and board-level signal routing choices.
- Compact Surface-Mount Package — 456-ball BGA (23 × 23) packaging supports dense PCB layouts while maintaining broad I/O and power delivery options.
- Commercial Temperature Rating — Specified operation from 0 °C to 85 °C for typical commercial applications and environments.
- RoHS Compliance — Conforms to RoHS requirements to support contemporary manufacturing and assembly processes.
Why Choose XC2VP7-5FGG456C?
The XC2VP7-5FGG456C delivers a practical blend of logic capacity, embedded memory, and I/O resources in a Virtex-II Pro family FPGA footprint. Its family-level features—documented processor integration, high-performance transceiver options, DSP primitives, and clock-management circuitry—make the device a capable platform for communications, embedded processing, and signal-processing applications where a programmable, in-system configurable solution is required.
Engineers and procurement teams looking for a commercially graded, RoHS-compliant FPGA in a 456-ball BGA package will find the XC2VP7-5FGG456C suitable for compact system designs that leverage the Virtex-II Pro architecture and its documented on-chip resources.
Request a quote or submit an inquiry to start procurement and learn about availability and pricing for the XC2VP7-5FGG456C.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








