XC2VP7-6FF896C

The XC2VP7-6FF896C is a Virtex®-II Pro field programmable gate array (FPGA) from AMD in a 896-ball FCBGA package. It provides a balance of programmable logic density, on-chip embedded memory, and a high I/O count for commercial embedded and board-level designs.

Designed for surface-mount assembly and commercial-temperature operation, this device is supplied within a defined core voltage range and is RoHS compliant for modern manufacturing flows.

Key Features

• Logic Resources — Approximately 11,088 logic elements to implement custom digital logic and state machines.
• Embedded Memory — Approximately 0.81 Mbits of on-chip RAM for buffering, FIFOs, and small lookup tables.
• I/O Density — 396 user I/O pins to support a wide variety of board-level interfaces and parallel connections.
• Package & Mounting — 896-ball FCBGA (896-FCBGA, 31 × 31 mm) package, surface-mount mounting for compact, high-density layouts.
• Power — Core supply voltage specified from 1.425 V to 1.575 V for predictable power design.
• Operating Range — Commercial temperature grade rated from 0 °C to 85 °C.
• Compliance — RoHS compliant, meeting lead-free manufacturing requirements.
• Manufacturer — Supplied by AMD with accompanying product documentation.

Unique Advantages

• High logic density: Eleven thousand-plus logic elements enable complex glue logic, protocol handling, and custom datapaths without external ASICs.
• Substantial on-chip memory: Approximately 0.81 Mbits of embedded RAM reduce the need for immediate external memory for buffering and small data structures.
• Extensive I/O capacity: 396 I/Os support broad connectivity options for parallel buses, control signals, or multiple peripheral interfaces.
• Compact system footprint: 896-ball FCBGA (31 × 31 mm) package supports dense board designs while remaining surface-mount friendly.
• Defined power and thermal envelope: Clear core voltage (1.425–1.575 V) and commercial temperature range (0 °C–85 °C) simplify power-supply and thermal planning.
• Manufacturing-ready compliance: RoHS compliance helps streamline assembly and regulatory requirements for commercial products.

Why Choose XC2VP7-6FF896C?

The XC2VP7-6FF896C is positioned for commercial embedded designs that require a mid-level FPGA with substantial logic capacity, generous on-chip memory, and a large I/O count in a compact FCBGA package. Its defined supply voltage range and commercial operating temperature make it suitable for standard industrial and consumer electronic applications where RoHS compliance is required.

Engineers selecting this device benefit from clear electrical and packaging specifications, making the XC2VP7-6FF896C a practical choice for prototype-to-production flows that rely on proven FPGA building blocks and available product documentation.

If you would like pricing, availability, or a formal quote for the XC2VP7-6FF896C, submit a request for a quote or purchase inquiry and our team will respond with details.