XC2VP7-6FF896I

IC FPGA 396 I/O 896FCBGA
Part Description

Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 396 811008 11088 896-BBGA, FCBGA

Quantity 292 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package896-FCBGA (31x31)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case896-BBGA, FCBGANumber of I/O396Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs1232Number of Logic Elements/Cells11088
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits811008

Overview of XC2VP7-6FF896I – Virtex®-II Pro Field Programmable Gate Array, 396 I/O, 896-FCBGA

The XC2VP7-6FF896I is an industrial-grade Virtex®-II Pro platform FPGA from AMD provided in a 896‑ball FCBGA package. It combines a configurable logic fabric with on-chip memory and a high-density I/O footprint, making it suitable for embedded processing and high-performance digital designs that require robust temperature and voltage operation.

Key Features

  • Logic Capacity: 11,088 logic elements (logic cells) to implement complex digital functions and custom hardware accelerators.
  • Embedded Memory: Approximately 0.81 Mbits of on-chip RAM for data buffering, FIFOs, and local storage.
  • I/O Density: 396 user I/O pins to support wide external interfaces and parallel buses.
  • Package: 896‑BBGA / 896‑FCBGA in a 31 × 31 mm footprint for high pin-count, surface-mount PCB assembly.
  • Power Supply: Core voltage range 1.425 V to 1.575 V to match typical FPGA power rails.
  • Temperature Range: Industrial operating range from -40 °C to 100 °C for deployment in demanding environments.
  • Platform Capabilities (family-level): Virtex‑II Pro family features include embedded PowerPC™ processor blocks, RocketIO™ multi‑gigabit transceivers, SelectRAM™+ memory hierarchy, 18‑bit × 18‑bit multiplier blocks, digitally controlled impedance I/O (DCI), on‑chip differential termination, digital clock manager (DCM), and SelectI/O™‑Ultra technology as documented in the Virtex‑II Pro product specification.
  • Mounting & Compliance: Surface-mount package with RoHS compliance for modern assembly requirements.

Typical Applications

  • Embedded processing systems: Implement custom processor interfaces, hardware accelerators, or offload tasks using the Virtex‑II Pro platform features.
  • High-speed communications: Use the family’s RocketIO transceiver and high I/O count for serial links and board-level protocol bridging.
  • Industrial control and automation: Leverage the industrial temperature rating and dense I/O for motor control, sensor aggregation, and real‑time logic.
  • Data buffering and interfacing: On-chip RAM and plentiful I/O enable data staging, protocol conversion, and wide parallel bus implementations.

Unique Advantages

  • High functional density: 11,088 logic elements combined with approximately 0.81 Mbits of embedded RAM reduce external component needs and simplify system architecture.
  • Large I/O surface: 396 I/O pins in a compact 896‑FCBGA package enable integration of multiple peripherals and wide data buses without sacrificing board area efficiency.
  • Industrial robustness: Rated for -40 °C to 100 °C operation, supporting deployments in harsh or temperature‑variable environments.
  • Platform-level processing and transceivers: Family-documented support for embedded PowerPC cores and RocketIO multi‑gigabit transceivers enables mixed-signal system designs and high-throughput interfaces where required.
  • Documented architecture and IP support: Comprehensive product specification coverage (architecture, I/O, clocking, memory, and transceiver function) aids design planning and integration.
  • Compliance-ready assembly: Surface-mount 896‑FCBGA package and RoHS compliance align with modern PCB manufacturing processes.

Why Choose XC2VP7-6FF896I?

The XC2VP7-6FF896I positions itself as a versatile Virtex‑II Pro platform FPGA option for designers needing a balance of logic capacity, embedded memory, and a high I/O count in an industrial‑rated package. Its documented family features—such as embedded processor blocks, multi‑gigabit transceiver capability, dedicated multiplier blocks, and advanced I/O management—support engineered solutions that combine programmable logic with embedded processing and high-speed interfaces.

This device is appropriate for engineering teams building industrial controls, communications interfaces, or embedded systems that require scalable logic resources, on-chip memory, and a robust operating range, while benefiting from the detailed product specification and IP core references available for the Virtex‑II Pro family.

Request a quote or submit an inquiry to receive pricing and availability information for the XC2VP7-6FF896I. Our team will respond with lead-time and ordering options tailored to your project needs.

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